Board-Warp-Sensing-Data-Sheet-English.pdf
Overvie w . The Board W arp Sensing system measures the height di erences of a printe d circuit board assemb ly as it is preheated and c alculates the down ward dee ction. The system automatic ally corre cts all Z-axis…
Overview. The Board Warp Sensing system measures the
height dierences of a printed circuit board assembly as it
is preheated and calculates the downward deection. The
system automatically corrects all Z-axis values compensating
for any warpage of the printed circuit board and eliminates the
need for traditional and labor intensive manual adjustment of
the soldering program.
Data from the Board Warp Sensing system is input into the
PhotoScan software which automatically adjusts Z-axis pro-
gram values compensating for any board deection.
Board Warpage Sensing
Laser-Based Measurement for Improved Process Control
Features and Benets
Measures board warpage and downward deection of circuit
board during preheating
Board warpage sensing system eliminates the need for labor
intensive manual adjustment of soldering program
Easy setup signicantly minimizes operator interface
reducing the possibility of human error and shortening
programming time
Board warpage sensing system utilizes laser-based
measurement technology requiring minimal preventative
maintenance
The Board Warpage Sensing system is an available optional
feature on Cerno® 508.1, Integra® 508.2, 508.3, 508.4 and 508.5
models
Page 1 of 2 2020-04-06
Integrated Solution. The Board Warp Sensing system fully
integrates with closed-loop process controls contained in
Nordson SELECT’s PhotoScan software providing seamless
operation for your selective soldering process. Nordson SE-
LECT’s closed-loop process controls enable successful results
for a full range of soldering applications and ensures stable and
repeatable results for high-yield production.
Experience. With over a decade of selective soldering experi-
ence and more than a thousand systems currently in produc-
tion, Nordson SELECT is committed to providing innovative
solutions for all selective soldering needs. Our global support
network, including state-of-the-art application development
labs, provides customers with world-class know-how and ap-
plication expertise.
Board warpage sensing soware interface
Barcode Warpage Examples
Board Warpage Sensing
nordsonselect.com
Europe
Hagenbach, Germany
+49.7273.949466.0 Phone
sales.eu@nordsonselect.com
Nordson SELECT GmbH
Perläckerstraße 11
76767 Hagenbach
Maastricht, Netherlands
+31.43.352.4466 Phone
info.eu@nordsonselect.com
North America
Headquarters
Liberty Lake, WA, USA
+1.509.924.4898 Phone
sales.usa@nordsonselect.com
China
info.cn@nordsonselect.com
Shanghai
+86.21.3866.9166 Phone
Beijing
+86.10.8453.6388 Phone
Guangzhou
+86.20.8554.9996 Phone
Japan
Tokyo
+81.3.5639.7020 Phone
Info.japan@nordsonselect.com
Korea
Seoul
+82.31.765.8337 Phone
info.kr@nordsonselect.com
India
Chennai
+91.44.4353.9024 Phone
info.in@nordsonselect.com
S.E Asia/Australia
Singapore
+65.6796.9514 Phone
info.sg@nordsonselect.com
Taiwan
+886.229.02.1860 Phone
info.sg@nordsonselect.com
For more information
speak with your local sales
rep or contact your regional
oice.
Page 2 of 2 2020-04-06
Circuit boards populated with heavy components or have routed or scored
panels tend to warp, or sag, towards the unsupported center of the board in the
Y direction. This is oen intensied when the board is preheated. The Nordson
SELECT Board Warpage Sensing system uses a laser to measure the Z-axis
deection and develops an oset correction. During production the solder
nozzle incrementally reduces the Z-axis height as it nears the lowest area of the
circuit board.
Typical printed circuit board warpage
Illustration of printed circuit board warpage
Compatible with Cerno
®
508.1, Integra
®
508.2, 508.3, 508.4
and 508.5 models