ElectonicsAssembly_Brochure.pdf
Y our pr oduct quality is our driv e ELECTRONICS A SSEMBL Y
Your product quality is our drive
ELECTRONICS ASSEMBLY
KEY FEATURES
Your product quality is our drive
Single Pick, Single Place
Having full control of your process
requires handling one component at a
time. All steps from look-before-pick
to pick, motion, place and
look-after-place can be fully
optimized, controlled, verified and
dedicated to that single component,
making it the most reliable process
possible in the industry.
Error-free production from the very first board
Quality begins before even producing the first
board. The right NPI and setup tools ensure that
all the boards come out right, the first time:
• Generates error-free programs;
• Defines parts and programs once;
• Error-free setups;
• Manages your material;
• Minimizes downtime between jobs;
• Fast feeder preparation;
• Closed-loop parts roundtrip; and
• Reacts fast to last moment NPI changes.
Changeover flexibility
iFlex offers best-in-class NPI and changeover flexibility,
regardless of volume and board sizes:
• Changeover in less than five minutes;
• Independent dual lane;
• Hot feeder swap;
• Random feeder placement;
• Intelligent product grouping; and
• Engineering change flexibility.
100% accurate component traceability
The Setup Assistant guarantees error-free set-ups and
enables full traceability:
• Material management;
• Material verification;
• Single barcode scan;
• 100% traceability from source to target material;
• Forced Feeder Re-scan;
• Single barcode scan; and
• Traceability data / report.
Fully controlled pick and place process
• No missing components: evert component is
continuously monitored throughout the pick-and-place
process by means of side view alignment and vacuum
flow sensors. This ensures all components are actually
placed at the right location;
• No cracked components: unique closed-loop active
force measurement and feedback ensures the correct
placement force is applied to every single placement.
The placement force builds up exactly to the set static
force; and
• Continuous board height measurement allows for high
speed placements at the highest quality.
Minimum component size
Maximum component size
Maximum component height
Optional height
Programmable placement
force (in steps of 0.1 N)
Maximum board size:
- Single lane
- Dual lane (per lane)
- Dual lane in Single lane mode
Maximum tape feeding
positions (8 mm)
Footprint (L x W)
Automatic toolbit exchange
Open MES data interfaces
Minimum board size
Maximum optional board
width
Application specific board
transport types
Board thickness
Minimum board size (optional)
Maximum optional board
length
Feeding options (other feeder
types on request)
Placement accuracy
@ Cpk > 1
Maximum output
IPC 9850/9850A
Maximum output per hour
0.4 x 0.2 mm (01005)
45 x 45 mm (1.77 x 1.77")
15 mm (0.60")
21 mm (0.83")
1.5 to 8 N
555 x 558 mm (21.8 x 22")
555 x 254 mm (21.8 x 10")
555 x 460 mm (21.8 x 18")
82 single tapes
162 twin tapes
2,340 x 1,844 mm (92.13 x 72.60")
Nozzles
CamX, others on request
50 x 50 mm (2 x 2")
-
-
0.3 to 6 mm (0.01 to 0.24")
-
845 mm (33")
Tape, stick
40 μm for passives
51k
70k
0.6 x 0.3 mm (0201)
120 x 52 mm (4.72 x 2.05")
25 mm (0.98")
50 mm (1.97")
4.0 to 60 N
555 x 558 mm (21.8 x 22")
555 x 254 mm (21.8 x 10")
555 x 460 mm (21.8 x 18")
81 single tapes
162 twin tapes
1,170 x 1,844 mm (46.06 x 72.60")
Nozzles, grippers
CamX, others on request
50 x 50 mm (2 x 2")
-
-
0.3 to 6 mm (0.01 to 0.24")
-
845 mm (33")
Tape, stick, tray, tubes
40 μm for passives
25 μm for QFP
7.1k
9k
0.25 x 0.125 mm (0201m)
45 x 45 mm (1.77 x 1.77")
10.5 mm (0.41")
12 mm (0.47")
0.3 to 8 N
515 x 390 mm (20.28 x 15.35")
-
-
130 single tapes
260 twin tapes
3,720 x 1,705 mm (146.46 x 67.13")
Nozzles
CamX, others on request
50 x 50 mm (2 x 2")
457 mm (18")
Vacuum transport, carrier transport
0.3 to 6 mm (0.01 to 0.24")
50 x 25 mm (2 x 1")
1500 mm (59.06")
Tape, waffle pack, tray, wafer, others
35 μm for passives
25 μm for QFP
18 μm for LED (*)
18 μm for QFP/BGA (*)
121k
165k
H1
T4-T2
502 / 5
SYSTEM SPECIFICATIONS
Maximum component size
Maximum component height
Optional
Footprint (L x W)
Maximum tape feeding
positions (8 mm)
Maximum # of Tray
components
Maximum output
IPC 9850/9850A
120 x 52 mm (4.72 x 2.05")
25 mm (0.98")
50 mm (1.97")
3,510 x 1,844 mm (138.19 x 72.60")
243
485
34
55,600 placements per hour
45 x 45 mm (1.77 x 1.77")
15 mm (0.59")
21 mm (0.83")
2,340 x 1,844 mm (92.13 x 72.60")
162
324
4
48,600 placements per hour
120 x 52 mm (4.72 x 2.05")
25 mm (0.98")
50 mm (1.97")
4,680 x 1,844 mm (184.25 x 72.60")
326
647
32
131,300 placements per hour
T2-T2 T4-T4-T2-H1
T2-T2-H1