MX600-8025042-Rev_B.pdf

MX600 ™ 2D A OI Contact C yberOptics today for mor e information +1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.c om Copyright © 2017-2021. C yberOptics Corporation. All rights reserved. S…

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MX600™ 2D AOI
Contact CyberOptics today for more information
+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2017-2021. CyberOptics Corporation. All rights reserved. Specications subject to change without notice. 8025042 Rev B
MX600
™
Automated Final Vision Inspection
Best Performance + Lower Cost of Ownership
Inspection Capabilities
Inspection Speed 110 cm
2
/sec
Minimum Component Size 0402 mm
Board Length Min. 25 mm / Max. 170 mm
Board Width Min. 17 mm / Max. 110 mm
Component Height Clearance (max) 35mm
Board Edge Clearance (min) 5.0 mm
Maximum Board Weight 3 kg
Maximum Board Warp Up to +/- 3 mm
Component Types Inspected Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more
Solder Joint Defects Categories Solder bridge, opens, lifted leads, wettability, excess and insucient solder, debris, and more
Other Items Detected Gold-nger contamination, pin-in-hole, bent pins, debris, and many others
Component Measurement
Categories
Component X, Y position and Rotation
Vision System
Imagers 80 Megapixel Sensor on each SIM module
Image Transfer Protocol PCIe
Lighting Strobe White Light (with dark/bright eld)
Resolution 12 μm pixel size
Image Processing Statistical Appearance Modeling (SAM™ ) Technology.
Option: Autonomous Image Interpretation (AI²) Technology
Programming Simple inline or oine
CAD Import
Any column separated text le (Standard information required - ref designator, XY, Angle, Part no.,)
System Specications
Power Requirements AC 220V, 3 phase, 60 Hz, 4 wire, Amp: 50A
System Dimensions 2.5m x 2.75m x 2.05 m
Weight 4.5 tons
Options
SPC Software, Alignment Target
Front Side
• Automated Final Vision Inspection for singulated memory modules
• Simultaneous dual-sided inspection with High Resolution (12μm) SIM
enabling 50% productivity improvement.
• Production Ready in <13 minutes† with AI
2
• 0402 Inspection Capability
• Lowest False Call Rate and Zero Escapes
• In line multiple module gripper to minimize handling tact time
• Traceability features
• S2/S8 compliance
A set of upgradable universal
handlers for multiple form factors
Inspect ‘Anything’
CyberOptics’ AI
2
(Autonomous Image Interpretation) technology
is designed for both low volume high mix, and high volume
low mix Applications, and builds on the proven success of our
Statistical Appearance Modeling technology. AI
2
is all about
keeping it simple - no parameters to adjust or algorithms to tune.
And, you don’t need to anticipate defects or pre-dene variance
either – AI
2
does it all for you.
Just draw a box, show a few good examples and you are
ready to inspect just about anything. Simply add good
examples to the Ai
2
model and the false call rates reduce
signicantly providing a very robust inspection solution.
MX600
™
Intelligent Sensing Technology
The SIM (Strobed Inspection Module) is the core engine behind every
MX600
TM
system enabling ‘on-the-y’ high performance inspection.
Designed and manufactured exclusively by CyberOptics, the SIM is
absolutely calibration-free and illuminates only when needed - reducing
cost of ownership and power consumption.
The dual SIMS provide a single platform for the inspection and defect
review process that shortens the production line and drives ~50%
productivity improvement. The SIM on the MX600 is designed with
enhanced illumination – delivering the best 0402 and nal vision
inspection performance ever. With an 80 Megapixel sensor and higher
resolution (12 μm), you get crisp, perfect quality images for more
accurate defect review.
AI
2
- Faster, Simpler, and Smarter
With AI
2
technology, programming gets even faster – with a 90%
reduction in examples required - so you get superior defect detection
and low false call rates even with just one example. This means
signicantly lower tuning time and quality results with one panel
inspection. Perfect for those high-mix or low volume applications!
With its unique ability to ‘ignore’ bad examples in a model, AI
2
oers
precise discrimination even with excessive variance and minimizes
eects of outlier examples.
Plus, it is a lot simpler with full support for unsupervised and semi-
automatic model training. And, examples are pre-sorted so you can
select and clear the ones you don’t need – very quickly.
The pixel marking feature highlights defective spots, so you can
identify genuine defects instantly.
Fast, Scalable SPC Solution
CyberReport
TM
oers full-edged machine-level to
factory-level SPC capability with powerful historical
analysis and reporting tools delivering complete
traceability for process verication and yield
improvement. CyberReport
TM
is easy to setup and
simple to use while providing fast charting with a
compact database size.
AI
2
Software:
Unique Image Processing Technique
Components Inspected/ Detected
SIM (Strobe Inspection Module)
Intelligent Ranking of Examples
Active Pixel Marking
3-Easy-Steps Programming
Our latest software improvements take programming
to a whole, new level – zero to production ready in less
than 13 minutes! All this is made possible, with an
all-new data-rich, pre-loaded library and automated
scripts that collect examples and update models – all
on their own.
Post-Test Defect Types,
Pre-Shipping Inspection
Inspection Capability includes:
- Components Edge
- Damage PCB Corner
- Goldnger Discolored / Burnt / Badly Scratched
- Gold tab inspection - Lifted tie bar, burnt, contamination
- Physically Damaged Components
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER