SQ3000-MULTI-8026235-REV_C.pdf

SQ3000 ™ SQ3000 ™ 3D A OI, SPI, & CMM The Ultimat e in Speed and Accuracy with Multi-Pr ocess Capability . The SQ3000™ oers unma tched accuracy with the revolutionary Multi-Reection Suppression (MRS) technology by …

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SQ3000™
SQ3000
™
3D AOI, SPI, & CMM
The Ultimate in Speed and Accuracy with Multi-Process Capability.
The SQ3000™ oers unmatched accuracy with the revolutionary
Multi-Reection Suppression (MRS) technology by meticulously
identifying and rejecting reections caused by shiny components.
Eective suppression of multiple reections is critical for accurate
measurement, making MRS an ideal technology solution for a
wide range of applications including those with very high quality
requirements.
AOI
SPI & CMM
All-in-one
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
SQ3000™ is an all-in-one solution that’s loaded with powerful tools
that cover inspection and measurement for AOI, SPI and CMM
applications.
Metrology-Grade Accuracy at Production Speed
– Achieve metrology-grade accuracy at production speed enabled by MRS technology.
– Attain repeatable and reproducible measurements for Industrial Metrology,
Semiconductor, Microelectronics and SMT applications.
Faster, Smarter, Award Winning Software
– Simplies process with powerful yet extremely simple software designed with an
intuitive interface that reduces training eorts and minimizes operator interaction.
– Take ease-of-use to a whole new level of inspection with multi touch controls and
3D image visualization tools with CyberOptics 3D AOI software that includes full SPI
capability, and expanded coordinate measuring capabilities with CyberCMM™.
– Add on CyberReport™ for full-edged machine-level to factory-level SPC capability.
Richer SPI Experience with Closed Loop, Feedback - Feed Forward
– Optimize printing process by proactively analyzing current trend data with the
standalone SPI software and CyberPrint Optimizer.
– Enable smarter and faster inspection that provides reduction in rework costs,
minimizes scrap and optimizes print process.
AOI SPI CMM
Contact CyberOptics today for more information
+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2018. CyberOptics Corporation. All rights reserved. Specications subject to change without notice 8026235 Rev C
SMT Inspection Capabilities MRS Sensor Ultra High Resolution MRS Sensor
Inspection Speed 40 cm
2
/sec (2D+3D), High Speed option
available: 50 cm
2
/sec (2D+3D)
15 cm
2
/sec (2D+3D)
Minimum Component Size 0402 mm (01005 in.) 0201 mm (008004 in.)
PCB Size SQ3000: 510 x 510 mm (20 x 20 in.), SQ3000-X: 710 x 610 mm (27.9 x 24 in.)
Component Height Clearance Top: 50 mm
Bottom: 30mm
PCB Thickness 0.3 - 5 mm
Component Types Inspected Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
pins, and more
Component Defects Missing, polarity, tombstone, billboard, ipped, wrong part, gross body and lead damage, and more
Solder Joint and Other Defects Gold nger contamination, excess solder, insucient solder, bridging, through-hole pins
3D Measurement Inspection Lifted Lead, package coplanarity, polarity dimple and chamfer identication
Solder Paste Inspection Height, area, volume, registration and bridge detection
Measurement Gage R&R <10% @ ±3σ
Z Height Accuracy 1 µm on certication target
Z Height Measurement Range 6 mm at spec, 24 mm capability 3 mm at spec, 10 mm capability
CMM Capabilities
Accuracy XY / Z 3 µm / 2 µm 2 µm / 2 µm
Resolution XY / Z 10 µm / 1 µm 7 µm / 1 µm
Maximum Weight SQ3000: 3 kg (5 kg Option), SQ3000-X: 10 kg
Min./ Max. Feature Height Min. 2 µm ; Max. 24mm Min. 2 µm ; Max. 10mm
Maximum Feature Size SQ3000: 510 x 510 mm (20 x 20 in.), SQ3000-X: 710 x 610 mm (27.9 x 24 in.)
Carrier Thickness 0.3 - 5 mm (10 mm Option)
Coordinate Measurement
Capability
Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Oset,
X,Y Oset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius,
Coplanarity/ Distance to plane / 2nd Order tting, Dierence / Absolute / 2sqrt / VC, Max / Min /
Ave / Sigma / Plus / Minus / Multiple
Vision System & Technology
Imagers Multi-3D sensors
Resolution Sub 10 µm 7 µm
Image Processing Autonomous Image Interpretation (AI
2
) Technology, Coplanarity and Lead Measurement
Programming Time <15 minutes (for established libraries)
CAD Import Any column-separated text le with ref designator, XY, Angle, Part no info; Valor process preparation
System Specications
Machine Interface SMEMA, RS232 and Ethernet
Power Requirements 100-120 VAC or 220-240 VAC, 50/60 hz, 10 amp max.
System Dimensions 110 x 127 x 139 cm (W x D x H)
Weight ≈965 kg (2127 lbs.)
Options
Barcode Reader, Rework station, SPC Software, Alignment Target., Programming Software: ePM-SPI/AOI & GC-PowerPlace, Oine Defect
Review. SQ3000-X (Large Board Capability), SQ3000-D (Dual Lane), and SQ3000-DD (Dual Lane - Dual Sensor) models available