ENG_SS_108-90801_E.pdf

Product Specification

108-90801

Rev. E

..................................................................................................................................................................................................................................…………………………….

DR. Bart Kerckhof DATE 19-jun-20

APVD. Jan Van Cauwenberge

DATE 19-jun-20

All International Rights Reserved.

* Trademark

| Indicates change

1 of 7

LOC GW

“Multispring standard power ST08” Press-in zone for automotive use

PCB Hole size

(1.39…) 1.45…1.54 mm

Board thickness

>=1.2 mm (nominal)

Stock thickness

0.8 mm

TABLE OF CONTENTS

1. Scope.

2. Printed board and hole information.

3. Press-in zone information.

4. Information on the application.

5. Instruction and tools for the press-in operation.

6. Press-in characteristics.

6.1 Mechanical.

6.2 Electrical.

6.3 Environmental.

7. Requirements.

8. Related Documents.

8.1 Test-Reports.

Product specification ‘Multispring standard power’ 108-90801

................................................................................................................................................................................................................................................…………………..

Rev. E Page 2 of 7

R1-1 (Rev. 02-00)

1. SCOPE .

This specification covers all the information as required in the IEC 60352-5 (Issue 5; Jan 2012) for a

Multispring Press-In zone (further named “Multispring”) for nominal hole-Ø 1.45mm and made from

0.8mm stock thickness.

The IEC requirements are supplemented with the requirements for automotive use (in the engine area)

based on the “Arbeitskreis Prüfrichtlinie für KFZ-Steckverbinder“.

2. PRINTED BOARD AND HOLE INFORMATION

 Printed board material according to :

IEC 61249-2-7 (replacement for the IEC 60249-2-4/5/11/12)

Other board materials are possible and have to be tested on request.

 Maximum number of conductive layers: not limited.

 Printed board thickness:

Normal range: min = 1.6mm ±0.14 mm; max = not limited.

Extended range: Min = 1.2mm … max = 1.6mm: allowed with some restrictions:

* The maximum deformation of the PCB-hole according to the IEC-norm cannot be

guaranteed for all types of PCB material used.

* With some plating combinations the hold force can be smaller than the limit of min.40N.

* Electrically less current can be put thru the press-fit and should be checked

* An application test is necessary to test the project specific situation

Smaller board thicknesses have to be tested.

 Plated-Through-Hole dimensions:

Hole-Ø prior to plating = 1.6±0.025 mm

Thickness of the PTH-wall > 25 µm Cu

Finished hole-Ø = 1.45-1.54mm

in case of HAL PCB’s or exceptional cases the former standard of 1.39-1.54mm is allowed.

 Printed board plating material :

HAL or galvanic tin plated 5 –15 µm

Chemical Sn > 0.5µm

0.05-0.2µm Au over 2.5-5 µm Ni

OSP (Organic Solderability Preservative) (not recommended)

Other plating materials have to be tested on request.

3. PRESS-IN ZONE INFORMATION

 Design : see dimensional drawing on page 3

 Material : CuSn4 , CuSn6 ,CuNiSi or CuCrAgFeTiSi or similar copper alloy.

Other materials have to be tested on request.

 Plating : - 0.4-1.5 µm Sn over min 0.8µm Ni.

- 0.4-1.5 µm SnPb over min 0.8µm Ni. (Technically possible but decommissioned)

- 0.3-1.1 µm S+D Advanced Indium over 1.27…2.2 µm Ni.

- Customer specific plating definitions are possible but have to be tested.

Not all combinations of plating, base material and PCB plating/technology are possible or

released. In case of doubt, please contact TE.

Product specification ‘Multispring standard power’ 108-90801

................................................................................................................................................................................................................................................…………………..

Rev. E Page 3 of 7

R1-1 (Rev. 02-00)

1.42

1.57

min 110

max 300