Nordson-EFD-Valve-Selection-Guide.pdf
Dis pense V alv e Select io n Guide
Dispense Valve
Selection Guide
Choosing the right dispense valve for an
application starts with the uid.
Use this guide to:
• See which Nordson EFD valves work with specic uids
and applications
• Compare the features of EFD valves and controllers
• Select a type of uid for an application
For example, if you know you want to use a jet dispensing
valve because of its significant precision and fast cycle rate,
you could use this guide to identify the types of fluids most
suitable for jetting.
Benefits
• Performance that’s proven for millions of
dispense cycles
• Long service life with minimal maintenance
• Worldwide technical assistance
• Global application testing labs
Please note this guide does not include every EFD dispensing
solution available. It’s important to speak with an experienced
EFD application specialist when choosing the right solution for
your application.
APPLICATION DEFINITIONS
Microdots
Any deposit having a volume
less than 5 µl.
(5 µl = 5 microliters =
5/1000 cc)
Dots
Any deposit having a volume
larger than 5 µl.
Jetting
Applying microdots, dots,
lines, stripes, and encapsulates
without making contact with a
surface—also called non-
contact dispensing.
Potting
Filling a cavity usually
containing an electronic device,
electronic circuit or wires.
Encapsulating
Applying a coating to an
electronic component for
protection from mechanical or
environmental damage.
Lines / Stripes
A line, bead or stripe of
material.
Filling / Packaging
Filling containers such as small
bottles, cartridges and tubes.
Microspray
Narrow spray pattern capability
as small as 1 mm (0.04") wide.
Spray
Applying fluids using low
pressure air to break the fluid
into fine droplets for coating or
marking.
Internal Spray
Spraying the inside diameter
of
holes and cylinders.
1
2
FLUIDS
VALVE APPLICATIONS
Microdots* Dots Jetting Potting Encapsulating Lines/Stripes
Filling /
Packaging
Microspray Spray
Internal
Spray
Internal Band
Accelerators xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet, P-Dot
— — xQR41V 752V-UHSS 781Mini 781S-SS 782RA 7860C-RS
Activators xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet, P-Dot
— — xQR41V 752V-UHSS 781Mini 781S-SS 782RA 7860C-RS
Alcohol xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— — xQR41V 752V-UHSS 781Mini 781S-SS 782RA 7860C-RS
Anaerobics
xQR41 PEEK**
752V-UHSS
xQR41 PEEK**
752V-UHSS
PICO Pµlse / XP
P-Jet
— — 752V-UHSS 725HF-A — — — 7860C-RS
Conformal Coatings xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— 752V-UHSS 752V-UHSS 725HF-SS 781Mini 781S-SS — —
Copper Braze Paste — 725DA-SS — — — 725DA-SS 725HF-SS — — — —
Cyanoacrylates
xQR41 PEEK**
752V-UHSS
xQR41 PEEK **
752V-UHSS
PICO Pµlse / XP
P-Jet, P-Dot
— — 752V-UHSS — — — — 7860C-RS
Electrolytes xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— — — 752V-UHSS 781Mini 781S-SS — —
Epoxies xQR41 752V-UHSS
PICO Pµlse / XP
P-Dot
725DA-SS 725DA-SS 725DA-SS 725HF-SS —
— — —
Fluxes, Liquid xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— — 752V-UHSS 725HF-SS 781Mini 781S-SS — —
Fluxes, Paste xQR41 725DA-SS
PICO Pµlse / XP
P-Jet, P-Dot
— — 725DA-SS 725HF-SS — — — —
Grease: low pressure
(to 7.0 bar ,100 psi)
xQR41 725DA-SS
PICO Pµlse / XP
P-Jet, P-Dot
— — 725DA-SS 725HF-SS — 781S-SS — —
Grease: med. pressure
(to 20.7 bar, 300 psi)
xQR41 736HPA-NV
PICO Pµlse / XP
P-Jet, P-Dot
— — 736HPA-NV 736HPA-NV — 781S-SS — —
Grease: high pressure
(to 172 bar, 2500 psi )
— 736HPA-NV
PICO Pµlse / XP
P-Jet, P-Dot
— — 736HPA-NV 736HPA-NV — — — —
Inks / Paints xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet
— — xQR41V 725HF-SS 781Mini 781S-SS 782RA 7860C-RS
Oils xQR41 752V-UHSS
PICO Pµlse / XP
P-Jet, P-Dot
— — xQR41V 725HF-SS 781Mini 781S-SS 782RA 7860C-RS
*Note: For microdot applications requiring general purpose tip sizes between 27 and 33 gauge, specify valve model xQR41 in place of 741V-SS. **Conditional use with cyanoacrylates.
Microdots: Any deposit having a
volume less than 5 µl (5 µl = 5 microliters
= 5/1000 cc).
Dots: Any deposit having a volume
larger than 5 µl.
Jetting: Applying microdots, dots, lines,
stripes, and encapsulates without making
contact with a surface – also called non-
contact dispensing.
Potting: Filling a cavity usually
containing an electronic device, electronic
circuit, or wires.
Encapsulating: Applying a coating to
an electronic component for protection from
mechanical or environmental damage.
Lines/Stripes: A line, bead or
stripe of material.
Filling/Packaging: Filling
containers such as small bottles,
cartridges, and tubes.
Microspray: Narrow spray pattern
capability as small as 1 mm (0.04”) wide.
Spray: Applying uids by using low
pressure air to break the uid into ne
droplets for coating or marking.
Internal Spray: Spraying the inside
diameter of holes and cylinders.
Application Denitions