SE500-X-8013863-REV_G.pdf

SE500- X 3D SPI Contact C yberOptics today for more informa tion +1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.c om Copyright © 2010-2020. C yberOptics Corporation. All rights reserved. S…

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SE500-X 3D SPI
Contact CyberOptics today for more information
+1 800.366.9131 or +1 763.542.5000 | CSsales@cyberoptics.com | www.cyberoptics.com
Copyright © 2010-2020. CyberOptics Corporation. All rights reserved. Specications subject to change without notice 8013863 Rev G
SE500
™
-X
3D SPI
World-Class Accuracy with Large Board Capability
EM Asia Innovation Award
for SPI V5 Software
System Specications
Panel Size Capacity (Max) 810 x 610 mm (32.0 x 24.0 in.)
Panel Size Capacity (Min) 100 x 100 mm (4.0 x 4.0 in.)
System Dimensions (W x D x H) 134 x 140 x 139 cm
Weight ≈ 1133 kg (2498 lbs.)
Maximum Panel Weight 10.0 kg (22 lbs)
Board Thickness 0.5 mm to 6.0 mm (0.02 in. to 0.24 in.)
Board edge clearance (Top) Top: 3.0 mm (0.12 in.); Bottom: 3.0 mm (0.12 in.)
Component Clearance (Top) Top (above belt): 20.1 mm (0.78 in.); Bottom: 25.4 mm (1.0 in.)
Conveyor Speed Range 150 - 450 mm/sec (5.9 - 17.7 in./sec)
Conveyor Adjustment Automatic
Functional Specications
Maximum Inspection Area 808 x 604 mm (32 x 23.8 in.)
Field-of-View (FOV) 32 x 32 mm (1.26 x 1.26 in.)
X and Y Pixel Size @ High Resolution: 15 µm (0.6 mils); High Speed: 30 µm (1.2 mils)
Paste Height Range 50 - 500 µm (2 - 20 mils)
Height Resolution 0.2 µm (0.008 mils)
Maximum Board Warp < 2% of PCB diagonals or max. of 6.35mm (0.25 in) total
Maximum Pad Size in FOV 15 x 15 mm ( 0.6 x 0.6 in.)
Measurement Types Height, Area, Volume, Registration, Bridge Detection, Defect Review
Machine Interface SMEMA, RS232 & Ethernet
Power Requirements 100 - 130 / 220 - 240V (10%), 50/60 Hz, 10 - 15 amps
Compressed Air Requirements 5.6 to 7.0 Kgf/cm² (80 to 100 psi @ 4 cfm)
Performance Specications
Inspection Speed @ 30um 108 cm²/sec peak (80 cm²/sec avg)
Inspection Speed @ 15um 65 cm²/sec peak (50 cm²/sec avg)
Fiducial, Barcode and Skip Mark All-in-one scan
Height Accuracy † 2 µm on a Certication Target
Gage R&R † <<5%, 6 σ on Printed Circuit Board; <<2% 6 σ on Certication Target
† Under controlled conditions
Options
SPC software, Barcode Readers (1D/2D), Programming Software: ePM-SPI/AOI & GC-PowerPlace, Oine Defect Review, Certication Target
Award-Winning
Intuitive Software
The brand-new V5 series software delivers world-class
user experience with its intuitive interface, completely
changing the way users interact with our system. Yet,
at the same time, the software is extremely stable and
simple to use enabling shortest learning curve.
With full multi-touch experience, SPI V5 series
software oers a range of revolutionary features that
enable smarter and faster inspection:
– Seamless integration of all applications - Teach,
Inspection, Defect Review and Real-time SPC
– Unlimited undo-redo and global search options in
Teach
– Loads of smart, informative and relevant charts that
provide yield summary, FPY information, hotspot
display, top 10 pad failures, historical panel and
more
– Easy, hassle-free operation using multi touch, multi-
selection, pinch-zoom, and pan-move options
SE500-X
World-class Accuracy at Fastest Speed
Designed and built by CyberOptics, the sensor is manufactured as an
integrated unit with no moving parts – which means no machine-to-
machine variation either. Plus, there is no drift over time, no parts to wear
and absolutely no recalibration needed.
High Speed, On-The-Fly Inspection
SE500-X incorporates CyberOptics’ patented 3D
sensing technology that uses white strobe light
acquiring full FOVs with each strobe and minimizing
vibration eects - delivering good accuracy and
consistent repeatability. You can measure ANY PCB
surface - including exible circuits - as white light
causes minimum diusion. With its continuous image
acquisition, you can be assured of fast, focused and
reliable inspection.
Fast, Scalable SPC Solution
CyberReport™ oers full-edged machine-level to
factory-level SPC capability with powerful historical
analysis and reporting tools.
Factory-level SPC
Line-level SPC
Machine-level SPC
Yield
Feedback, Feed Forward Ready
SE500-X fully supports feedback and feed forward
capability with leading Solder Paste Printer and
SMT Mounter vendors respectively. With simple
conguration settings, SE500-X gives you the power
to do more with SPI results - optimize printing process,
establish stencil cleaning cycles and ne-tune printer
setup. All this means reduced rework costs, increased
production throughput and improved yields.
Defect Review Interface
Hot Spot Display
Real-time SPC
CyberPrint OPTIMIZER™ Ready
CyberPrint OPTIMIZER™ automatically
optimizes the print process by proactively
analyzing accurate trend data - rst-ever in
the industry! Pre-dened templates help you
get started quickly while customizable rules
support perfect customization for specic
product needs. CyberPrint OPTIMIZER™‘s
predictive process improvement gets you
better yields and reduces downtime.
Failure analysis drives line optimization and auto tolerance changes
Defect Correlation
SPI AOI AOI
FAIL
FAIL
FAIL
FAIL
FAIL FAIL
PASS PASS
PASS
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER
CYBERREPORT
SPISOFTWARE
AOISOFTWARE
CYBERREPORT
CYBERCMM
SPISOFTWARE
AOISOFTWARE
CYBERCMM
CYBER
PRINTOPTIMIZER
CYBER
PRINTOPTIMIZER