ke 2070.pdf
KE–2070/2080 Multi-purpose mounter KE-2060 successor machine 6 nozzles with Laser Align and IC head without Laser Align High speed chip shooter KE-2050 successor machine 6 nozzles with Laser Align KE-2070 KE-2080
KE–2070/2080
Multi-purpose mounter
KE-2060 successor machine
6 nozzles with Laser Align and
IC head without Laser Align
High speed chip shooter
KE-2050 successor machine
6 nozzles with Laser Align
KE-2070
KE-2080
16,000CPH
16,000CPH
with 6 pick & place nozzles.
with 6 pick & place nozzles.
IPC9850. Excluding conveyer
transportation time.
At Laser recognition placement.
M PCB type and front reference
0201 and bigger chip parts
6 parts measuring capability at the same time
Wider parts handling---Up to 33.5 mm square
Higher accuracy by simple and robust structure
MNLA LNC
LNC60
New Concept
New Concept
Laser Align
Laser Align
New Design Head
New Design Head
±50μm@Cpk≧1 (0201
and bigger chip parts)
(Note1)
1μm resolution for XY
positioning
260k pulse / rotation
resolution for rotation (All
head axes)
(Note2)
Simple and robust.
Note1 : ±40μm@Cpk≧1 for 01005 at specified condition
Note2 : Approximately 8K PPR rotational resolution for 2050/2060 Laser Heads
Wider Parts Handling
Wider Parts Handling
Range
Range
01005 placement capability
(0402 in metric)
Up to 33.5 mm square parts by
LNC60 Laser align sensor.
Placement capability for most
of 1.27 mm pitch BGAs.
MNVC function on KE-2070
(optional)
Placement load control
(optional)