SSM-EN-ZEVAC-Flyer.pdf
SSM 4A / SSM 9 The distribution of this document is not permitted without express permission – 02.22 Repair of through hole parts
SSM 4A / SSM 9
The distribution of this document is not permitted without express permission – 02.22
Repair of through hole parts
SSM 4A / SSM9
The SSM machines are used for selective
soldering and desoldering of multilead,
trough-hole technology components.
Due to the programmable parameters precise
and repeatable results can be achieved,
user-independent.
MARKET REQUIRMENT
Enhanced effectiveness
• Fast positioning with the air nozzle
• Soldering and desoldering at the same time/position
• Reliable blow-out of solder holes from above, immediately after
removal of the device
Enhanced quality
• Precise adjustment of soldering parameters
• Reproducible results
• Non mechanical stress protects device and circuit board against
damage
• Adjacent devices are protected during soldering process.
Heat is isolated to a single component
• Flexible solutions for standard or irregular
shaped components
• Repeatable soldering results due to dened
process parameters as soldering temperature,
process time, wave height, ramp up and ramp
down or regarding the SSM 9, up to 10
programmable parameters
• Easy height adjustment of the printed circuit
board over the ow well
• Stable construction: Easy to use and stable table
top machine
• Also irregular shaped boards up to a size of
840 x 600 mm can be xed on the quick locking
board holder
• Blow out option to clean the solder joints after
removal of a connector
• Application specic tooling for any kind of
component also on dense populated boards,
including multi soldering solutions, for wetting of
dened positions
• Optional preheater module PH 4, especially for
the lead-free applications
• Lead-free retrot: Already installed machines
can be retrotted for lead-free applications
MAIN FEATURES
Swiss Engineering
Due to up to ten programmable
parameters as soldering
temperature, cycle time, wave
height, ramp up and ramp down,
precise and repeatable soldering
results occur.
SELECTIVE SOLDERING,
TROUGH-HOLE TECHNOLOGY
APPLICATION RANGE
SSM 4A UND SSM 9 – REPAIR OF TROUGH HOLE PARTS
Swiss Engineering
Repairs
Damaged components can be replaced.
Prototyping
Prototypes can be equiped and soldered in an ecient way with the SSM 4 and SSM 9.
Retrots
• Components which are missing at production time
• On the soldering side components have to be placed
• A SMD equipped board has to be extended by single wired components
Soldering
When equiping boards with only few components the use of the solderingand desoldering machines SSM 4 or SSM 9 is in most cases
the simplest and most economical way.
Saves time
The system’s ergonomic design speeds up and simplies your work and generates results that comply with the most stringent quality
requirements.
No Restrictions
The SSM 4 and SSM 9 will dependably handle even the most dicult soldering and desoldering jobs:
• Operations on multilayer boards
• Processes components with complex geometries such as DIP switches and long connectors
• Operates on dense mixed technology boards
• Soldering on the assembly side, even between adjacent high components
• Soldering and desoldering of Pin Grid Arrays and sockets
• Soldering on ex boards
OPTIONAL PREHEATER MODULE PH 4
To improve the performance for lead-free applications
The preheater module PH 4 can be used as individual device or
together with the SSM 4A or the SSM 9. By preheating the
PCB before the selective soldering process is carried out the risk
of copper delamination is reduced.The preheater PH 4 uses IR
technology to preheat the printed circuit board on an area of
300 x 300 mm with a performance of 3500 watt.