XM8000 Brochure v6a web.pdf
Complexity Simplied www .nordsondage.com Intelligent X-ray Metr ology
Complexity Simplied
www.nordsondage.com
Intelligent X-ray Metrology
Your Defect Detection Expert
2 | Nordson DAGE XM8000 Intelligent X-ray Metrology
Founded in 1961, Nordson DAGE is part of the Nordson Corporation
with a revenue of over $1.8 billion and over 6,000 employees worldwide.
Based in the UK, Nordson DAGE is the market leading provider of
award winning X-ray inspection systems. We enable our customers to
detect defects earlier in the manufacturing process to maximize product
quality, ROI and reduce costs.
Over 25% of Nordson DAGE employees are dedicated to Research,
Design and Development. Our vertically integrated approach gives full
control over all key technology components in our X-ray inspection and
metrology systems.
Dedicated X-ray and
Semiconductor teams
have focused their
expertize to create the
ultimate platforms for
wafer and packaging
level metrology.
Complexity Simplied
3 | Nordson DAGE XM8000 Intelligent X-ray Metrology
The semiconductor market demands increasingly complex devices that
are enabled by technologies such as TSV, PoP, 2.5D and 3D integration.
These complex products demand a new level of metrology. The XM8000
system delivers fully automated, non-destructive, radiation safe defect
detection for all complex devices.
202120202019201820172016
WLP GROWTH
2015
20142013
RF
MEMS
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CIS
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FPGA
Memory Photonic
RF
MEMS
CIS
FPGA
Memory
Photonic
TSV wafer starts, breakdown by application. Source: Yole Dévelopment September 2016.
Nordson DAGE XM8000 Intelligent X-ray Metrology | 3
Measured Solutions
TSV Metrology
XM8000-5 WB measures wafer bump characterization
including voiding, presence, position, shape, size
and bridging. Unlike optical tools, XM8000-5 WB can
measure voids within the wafer bump.
XM8000-7 TSV delivers high throughput metrology of
TSVs. Advanced 3D techniques are used to analyze
shape, ll and voiding at sub-micron levels.
Wafer Bump Metrology
Void Count
Silicon substrate
Position
Position
Presence
Prole
Position
Percentage Voiding
Fill
Size
Count, Volume
Silicon substrate
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Nordson DAGE XM8000 Intelligent X-ray Metrology | 5
Wafer Level Packaging
XM8000-WLP enables in depth analysis of all forms
of wafer level packaging. This analysis is customized
for such defects such as Cold Joints, Head in Pillow
(HiP), misalignment and missing features.
The intelligent, self learning capability of XM8000
allows unrivaled detection of micro defects in
complex packages.
Misaligned
Cold Joint
MEMS
CIS
FPGA
Memory
RF
Photonic
Head in Pillow
Layer Alignment
Silicon substrate
TSV
4 | Nordson DAGE XM8000 Intelligent X-ray Metrology