ASMdatasheet_SIPLACE TX micron_V4_11_2018.pdf
The new SIPLACE TX micron Maximum accuracy for advanced production – The high density system-in- package, IoT modules, wearables and submodules require highest accuracy in a high volume production environment. The SIPLAC…
The new SIPLACE TX micron
Maximum accuracy for advanced production – The high density system-in-
package, IoT modules, wearables and submodules require highest accuracy
in a high volume production environment. The SIPLACE TX micron platform
is developed to achieve best in class accuracy and to maximise the highest
volume production in a compact and highly scalable placement machine.
The increasing demand for the mobility and connected world
of the future requires a combination of high accuracy, higher
throughput and the ability to handle fragile components in a
compact placement platform.
The new innovative SIPLACE TX micron meets the requirements
of electronics assembly industry and packaging industry.
With many new features like the high resolution glass scales and
glass ceramics ducials for gantry movement and “Touchless
Placement” mode for the accurate process control for placement
onto ux, paste or epoxy, the SIPLACE TX micron achieves new
benchmarks in placement performance and productivity per area.
High Accuracy Package
Key benets at a glance:
■ Up to 78,000 cph (Benchmark) for higher throughput and
floorspace performance
■ Better accuracy (up to 15 µm @ 3σ) for placing high density
boards and advanced packaging applications
■ Selectable accuracy for individual components to place each
component at the required accuracy with minimum impact
on the throughput
■ Programmable low placement force (0.5 N) and even
“Touchless Placement” mode for fragile or sensitive
components
■ Centralised placement program creation and management
allows easy recipe download to placement machine
■ Innovative SIPLACE Software portfolio to support the
productivity and operational efficiency of your production
High resolution
glass scales
Additional ducial bar –
Y direction (15 μm only)
SIPLACE SpeedStar
CP20 M2*, with
high resolution scales
Low expansion glass
ducial bar – X direction
* Also be fitted with high resolution SIPLACE MultiStar CPP M
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SIPLACE Hardware
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SIPLACE TX micron
„Touchless Placement“ – New and unique to SIPLACE
Fragile components such as dies can be precisely and
controllably placed with the SIPLACE SpeedStar CP20
placement heads using a placement force of a mere 0 N.
SIPLACE TX micron
Placement speed (benchmark) up to 78,000 cph
Placement accuracy @ 3 sigma up to 20 µm up to 15 µm
PCB Dimensions (I x w) Dual: 50 mm x 45 mm to 375 mm x 260 mm
Single: 50 mm x 45 mm to 375 mm x 430 mm
50 mm x 55 mm to 250 mm x 100 mm
Machine Dimensions (L x W x H)
Feeder slots
Typical power consumption
Air consumption
Certifications
Key standards PCB conveyor interface
1.00 m x 2.23 m x 1.45 m
Up to 80 x 8 mm, Jedec Tr
ay
1.9 kW
120 Nl/min (2 x SIPLACE Speedstar)
Semi S2/S8, Clean room class ISO 7
IPC-HERMES-9852, IPC-CFX, IPC-SMEMA-9851
Available placement heads
Placement heads SIPLACE SpeedStar SIPLACE MultiStar
Placement speed (benchmark) 39,000 cph 24,000 cph
Component range 0.12 x 0.12 mm to 6 x 6 mm 0.11 x 0.11 mm to 15 x 15 mm
Min. lead pitch
70/50* µm
120 µm
Min. lead width 30/25* µm 50 µm
Min. ball pitch 100/50* µm 140 µm
Min. ball diameter 50/25* µm 70 µm
* With optional high resolution camera (SST49) with blue light.
ASM Assembly Systems GmbH & Co. KG
Rupert-Mayer-Strasse 44 | 81379 Munich | Germany | Phone: +49 89 20800-27819
smt-solutions.de@asmpt.com | www.asm-smt.com
This brochure contains only general descriptions and/or features which may not apply to a specific product or may change as a result of new product developments.
Any specific performance features and/or capabilities will only be binding if contractually agreed upon. | A10011-ASM-G175-EN Edition 04-11/2018
Just two heads to meet the requirements for your
module assembly
The SIPLACE SpeedStar, as high speed
Collect&Place head, combines handling of components
sizes as small as 0201 (metric) with extremely high
placement performance and accuracy.
The SIPLACE MultiStar, with its unique combination of
three diff erent placement modes, covers a very wide
component range.
SIPLACE SpeedStar:
maximum performance
SIPLACE MultiStar:
maximum flexibility
∆ Controlled
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