Firefly-NX-LINE-UK.pdf

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PROXIMA S.R.L.

E-mail: info@proxima-ate.com

SEICA Inc.

E-mail: DavidSigillo@seicausa.com

SEICA FRANCE SARL

E-mail: stephane.dupoux@seica.fr

SEICA DEUTSCHLAND GmbH

E-mail: marc.schmuck@seica.com

SEICA ELECTRONICS

(Suzhou) Co.Ltd.

E-mail: seicachina@seica.com

SEICA WORLDWIDE

GLOBAL SUPPORT NETWORK

SEICA SpA

via Kennedy 24

10019 Strambino - TO - ITALIA

Tel: +39 0125 6368.11

Fax: +39 0125 6368.99

E-mail: sales@seica.com

www.seica.com

Thanks to the global extension of Seica

and its subsidiaries, Seica can ensure

local service support wherever the

customer needs it,

in addition to 24-hour

telephone assistance.

Brochure Firefly - series UK ver. 04 11/2019

After many years of development and several installations worldwide, the

Firefly

line has completely redesinged its architecture,

taking a major step forward and setting the way for the

NEXT> generation generation.

FLE

IBLE AND CONSTANTLY MONITORED

PROCESS

The

Firefly

NEXT> line offers an excellent

alternative for the selective soldering process, taking full advantage of laser

technology to provide a clean and efﬁcient solution. The modular hardware

architecture of the

Firefly

NEXT> systems, combined with its

sophisticated software, enable deployment in different

manufacturing

environments

: multi-product, which require ﬂexibility and fast setup times, or

high-volume production, where process control and repeatability are key.

Firefly

NEXT> introduces a laser beam which is orthogonal to the solder joint, and the

donut spot, to improve the focusing of laser energy where required, and offering suitability for very small-sized pads

providing clear advantages in terms of applicability and process repeatability.

A minimized footprint, efﬁciency and cleanliness (low maintenance), accompany a flexible, monitorable and

certifiable soldering process, making the

Firefly

NEXT> Selective Soldering System the ideal

soldering solution to resolve manufacturing issues, both in EMS (Electronic Manufacturing Services) and OEM

industries, such as Automotive.

ERSE SOLUTIONS

The soldering head, which is the core of the system, is common to both the

Firefly B60

and

T60

NEXT>

machine conﬁgurations. The two solutions are characterized mainly by the side of the board where processing is performed:

the BOTTOM solution, where the soldering process is carried out

from below the PCB, and a TOP solution, where the soldering process

is carried out from above the printed circuit board. This conﬁguration

is particularly suitable for automated processes where the system is

integrated into an existing conveyor line.

The

Firefly

NEXT> soldering systems

can be successfully integrated into high-volume

production lines, as well as in those cases where the

products to be soldered are continuously changing

and LeadB and

Lead-free processes are often mixed.

INDUSTRY 4.0

The

Firefly

NEXT> has all of the capabilities needed

for implementation in any

Factory 4.0 scenario, providing the

possibility to plug in any proprietary or third party information

system to achieve the desired goals.

m Allows point by point adjustment of the power needed for soldering; the lack of thermal inertia of the laser

combined with real-time temperature readings, enable the dynamic correction of the thermal profile.

m The orthogonal position improves the energy transfer

m The donut beam allows to radiate energy only on the pad and not on the hole, preventing

damages to components and harmonizing the temperature of pin and pad

m The ability to apply all of the energy in a single point makes this technology

applicable in all those situations where it is not admissible to heat the whole board,

or where there is limited access.

m Changing from “Lead” to “Lead-Free” soldering is simply a matter of changing a

spool of solder wire.

m The laser soldering process is clean, which eliminates the need to clean, and

subsequently handle, the processed boards, and the power consumption of the Firefly is

extremely low compared to other types of soldering technologies.

m The Firefly systems are ready to solder as soon as they are switched on, without preheating, making them an

extremely flexible tool in a manufacturing environment.

THE ADVANTAGES OF LASER TECHNOLOGY

VIVA: A GROWING SOFTWARE

The

Firefly

NEXT> is

managed through the VIVA software,

common to all Seica systems. By means of its

intuitive graphical interface, the software

guides the programmer. When CAD data

are available, the software can import the

coordinates automatically, otherwise, the coordinates of the points to be soldered can be

acquired through the camera.

VIVA will automatically generate a soldering program, optimized according to the geometrical

and dimensional characteristics of the points to be soldered, allowing to

modify the soldering parameters.

An innovative graphical

operator

interface is

available, speciﬁcally

designed for manufacturing environments, which

allows the customization of the layout of the control

buttons and the information displayed on screen,

translatable into any language.

Firefly

NEXT>

LASER SELECTIVE SOLDERING SYSTEMS

PROCESS TRACEABILITY

Process traceability is ensured by the possibility to collect the

video recording and thermal profiles acquired for every

solder joint, and to associate them to the serial number of the

printed circuit board. The collection of this data is also valuable

as a debug tool of the soldering process.

As a global partner, Seica is able to design and customize speciﬁc

solutions for its customers also for the sector of laser selctive soldering

With a maximum power absorption of 2.5

KW/h, the

Firefly

NEXT>SERIES

is easy to manage and maintain. In addition,

the utilization of ﬂux-based soldering alloys

eliminates the need to use

external fluxing

stations

, as well as the necessity for

nitrogen

. The consumption of solder alloy is

limited to the amount applied to each joint,

generating zero waste and eliminating

disposal costs.

IRONMENT-FRIENDLY

CUSTOM SOLUTIONS