Asterion_EV_Brochure_05042017PDFA.pdf

Enhanced Capability Hybrid W edge Bonder One Bonder , Multiple Interconnect Solution One Bonder , Multiple Interconnect Solution The Asterion TM EV (Extended V ersion) Wedge Bonder is built on a reengineered architecture…

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Enhanced Capability
Hybrid Wedge Bonder
One Bonder, Multiple Interconnect Solution
One Bonder, Multiple Interconnect Solution
The Asterion
TM
EV (Extended Version) Wedge Bonder is built on a
reengineered architecture that includes an expanded bond area, new robust
pattern recognition capabilities and extremely tight process controls.
Together these deliver heightened productivity, bonding quality, and
reliability. The enlarged bondable area enhances flexibility and reduces line
integration costs. Asterion is driven by a precise new direct-drive motion
system that requires minimum maintenance and delivers high repeatability.
The graphical editor, multi-segment bonding, global parameter change, and
a library of new software features, make programming and optimizing
bonding process of complex devices relatively easier.
Key Features
Battery Bonding
▪ Compensation for height variations between surfaces
▪ Real-time physical testing with the non-destructive pull tester
▪ Self-contained/Built-in wire feed dispensing system
▪ No heat applied, all work done at ambient temperatures
Productivity
▪ Large bondable area (300 mm x 860 mm) reduces indexing/loading time
▪ Resistive touchscreen monitor
Performance
▪ Consistent process results
Configuration Flexibility
▪ Single platform offering a range of interconnect solutions for Al and Cu wires —
Large wire, small wire and PowerRibbon
TM
with a wide range of bond head selection
▪ Supports multi-device and multi-lane automated handler
Ease of Use
▪ Intuitive Graphical User Interface (Windows 7 OS)
Maintenance and Reliability - Lower Cost-of-Ownership
▪ Highly reliable direct-drive XYZT motion system requires no adjustments and less
frequent preventive maintenance
▪ Reduced preventive maintenance requirements on major components
For sales, service and manufacturing locations, visit www.kns.com
© 2017 Kulicke & Soa Industries, Inc. Specifications may change without notice.
The Asterion EV logo, Asterion EV, K&S logo, and Kulicke & Soa are trademarks of
Kulicke & Soa Industries, Inc.
WB-007-01/2017
Enhanced Capability
Hybrid Wedge Bonder
Enhancements
Options
Additional Enhancements
Specifications
Graphical Editor for convenient program editing Loop Former option enables advanced square shaped
loops profiles
Robust PR (GS4) with Feature Find and Geometric
Model modes developed for difficult patterns like direct
bonded copper (DBC) substrates
Multi-Segmented Bonding cycle allows precise
control and flexibility of the bonding process
▪ Light intensity calibration normalizes PR light settings across all machines
▪ Process programs, stored on a host for control, are available to download to
individual bonders
▪ Process logging for each bond can be stored and accessed offline for
traceability
▪ Consumable tracking and bar code verification capability
General
Power Requirements (Electrical): 180 - 240 VAC, Single Phase,
50/60 Hz, 2.0 kVA
Nitrogen: Min 275 kPa - Max 1000 kPa, 2-10 L/min
(Small wire only)
Work Height: Adjustable 939 - 985 mm from Floor
Foot Print:
With operator panel: 800 (W) x 1971 (D) x 1955 mm (H)
Whout operator panel: 800 (W) x 1728 (D) x 1955 mm (H)
Weight: 1015 kg Uncrated without work holder insert
CE Certification: Standard
Pattern Recognition/Optics/Vision
Vision System: GS4 Pattern Recognition System
New PR Modes: Feature Find, Single Point with Angle, Geomodel
Motion System
X, Y Axes: Linear motors, 0.1 μm Resolution
Bond Area: 300 x 860 mm
Z-Axis: Voice Coil, 0.1 μm Resolution; 50 mm Z-Stroke
Θ-Axis: Direct Drive; ± 220°, 0.0057° Resolution
Repeatability: ± 3.0 μm at 3 σ
Interconnect Options
Large Wire - Wire Range: 100 - 500 μm Diameter
PowerRibbon - In Development
Material Handler
Handler Bay:
With Insert: 1080 (D) x 424 mm (H)
Open Bay: 1080 (D) x 583 mm (H)
Standard Integrated Handlers Available
Non-Destruct Pulltesting
Bondhead Pulltest:
Large Wire ALC bond head
Configurable bond head
▪ Newly designed Graphical Bond head Set-up aid option (GBS) reduces
consumable replacement time & ensures a repeatable set-up
▪ Bond Process Monitoring option (BPM) helps keep tight control of the
bonding process
▪ SECS-GEM option enables factory automation and communication
▪ Programmable status light can be programmed for customized conditions
Non-Destructive Pulltest gives 100% physical testing
of the bonds after they are made which in turn offers
real-time quality physical control
Bonded Device Review can capture camera images
after bonding a device in Auto and display them for
review while bonding the next device