SIPLACE CA4 V2规格说明书.pdf

SIPLACE CA4 Specification SIPLACE CA4 Editi on V2 from SR.713.1, 05/2020 Edi tion High volume SMD, Flip Chip and Die Bonding

SIPLACE CA4

Specification SIPLACE CA4 Edition V2 from SR.713.1, 05/2020 Edition

High volume SMD, Flip Chip and Die Bonding

SIPLACE CA4

Contents

Overview of technical data 5

Maximum values 5

Machine description 6

Overview 6

Placement performance and accuracy 8

Pick up from the changeover table (SMT) 8

Pick up from the SIPLACE Wafer System 9

Placement heads 10

SIPLACE SpeedStar (C&P20 M2) 10

SIPLACE MultiStar (CPP M) 11

Nozzle changer 12

Technical data 13

Single lane and dual lane conveyor 14

Overview 14

Technical data 15

Placement modes 16

Alternating placement mode 17

PCB warpage 18

Panel lane and wafer lane conveyor 20

Panel lane conveyor 20

Wafer lane conveyor 21

Technical data 22

Wafer and panel level fan out process 23

Workpiece carrier warpage 24

Component feeding 25

Component trolley X 25

SIPLACE SmartFeeder X / Xi 26

Alternative SIPLACE modules 27

SIPLACE MeasuringFeeder X 28

SIPLACE JTF-M 29

Technical data 30

SIPLACE Wafer System 31

Overview 31

Component supply 32

Technical data 33

List of options 34

SIPLACE Vision 35

OnBoard Inspection and Pattern Matching 35

Cracked Die and Chipping Detection 36

PCB position recognition 37

Barcode types 39