SP18.pdf

MODEL NUMBER NM-EJP1A PNEUMA TIC SOURCE 0.5 MPa, 30 L/min (A.N.R.) Electronic Assembly Mounting System SP 1 8P -L PCB 50 mm x 50 mm DIMENSIONS 510 mm x 460 mm (330 mm x 250 mm *1 ) DIMENSIONS L 550 mm x W 650 mm (v er ti…

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MODEL NUMBER NM-EJP1A
PNEUMATIC SOURCE 0.5 MPa, 30 L/min (A.N.R.)
Electronic Assembly Mounting System
SP18P-L
PCB
50 mm x 50 mm
DIMENSIONS
510 mm x 460 mm (330 mm x 250 mm
*1
)
DIMENSIONS
L 550 mm x W 650 mm (vertically oriented)
*1
, L 600 mm x W 550 mm (horizontally oriented)
*1
ELECTRONIC SOURCE 1-phase AC 200 V
*2
, 1.4 kVA
*3
DIMENSIONS
*2
1,100 mm
1,536 mm
*4
1,430 mm
*5
MASS
*4
1,250 kg
SP18P-L
Min L x W to
Max L x W
W
D
H
Screen Printer
• Ultimate, economical solution for lean SMT manufacturing
*1
For M size specification (option)
*4
Handle external dimension
*2
Compatible with 220 / 230 / 240 V
*5
Excluding monitor and signal tower
*3
Including blower
note: Values such as cycle time and accuracy may vary depending on operating conditions.
Please refer to the specification booklet for details.
CYCLE TIME 8.0 s + printing time
REPEATABILITY ±12.5 µm
SCREEN FRAME
L 736 mm x W 736 mm, L 650 mm x W 550 mm (horizontally oriented)
• Our original uni-floating printing method ensures excellent filling
performance regardless of board asperity.
• High-quality printing with high-speed multi snap-off success of the
SP80/60 series.
• Light cleaning prevents the flux from drying, maintaining solder
transcription quantity.
© Copyright 2006 Panasonic Corporation of North America. All rights reserved. Changes may be made without notice to specifications and appearance for product improvement. EAG014.01
Panasonic Factory Solutions Company of America
1-847-495-6100
PFSAmarketing@us.panasonic.com
www.panasonicfa.com
Safety Caution: To ensure safety when using this equipment, all work should be performed in accordance with the supplied operating instructions. Thoroughly read your operating instructions manual.
New Printing Method Reliably Delivers the Right Amount in the Right Form
UNI-FLOATING PRINTING METHOD
Negative clearance
Squeegee angle: Fixed (0)
Printing pressure: Adjusted automatically (feedback control)
HIGH-SPEED MULTIPLE SNAP-OFF
Local decrease in solder viscosity
Stable form and quantity of
solder transcription on the
entire board
CSP 0.5mmp
Before cleaning After cleaning
Because the flux does not dry up, the solder transcription quantity
maintains stability.
• User-friendly, easy-to-operate functions enable the operator to set parameters based
on production requirements – making print condition adjustments nearly automatic.
• Automatic batch teaching of the board and mask recognition marks.
User-Friendly Design
Board Type Selection Key
Standard Conditions are Set
Condition Adjustment Key
Detailed Setting Key
Batch teaching
Recognition mark search functions
LIGHT CLEANING
• Advanced type prevents the solder from leaking out
of the printing area. It also reduces the waste solder
and prevents the mask from being clogged with
deteriorated solder.
• Achieves stable and higher-quality printing via a plastic
squeegee that ensures the solder transcription quantity
without damaging the mask.
Stable, High-Quality Printing Process
Automatic correction
ADVANCED TYPE
Adjustable block
according to the
board size
Solder leak out state
SOLDER
TRANSCRIPTION
QUANTITY
Mask surface condition after 30,000 printings
Plastic squeegee Metal squeegee
20
40
60
80
100
Urethane
Plastic
Metal
% Transcription rate