NYTBXDSL.pdf
Nordson YESTECH’ s advanced 5 megapixel color camera imaging technolog y offers benchtop PCB inspection with ex ceptional defect coverage. This benchtop system inspects solder joints and verifies correct par t assembly e…
Nordson YESTECH’s advanced 5 megapixel color camera
imaging technology offers benchtop PCB inspection with
exceptional defect coverage. This benchtop system inspects
solder joints and verifies correct part assembly enabling users
to improve quality and increase throughput. The optional four
side viewing cameras add additional inspection capabilities
found only on in-line systems.
Programming the BX is fast and intuitive. Operators typically
take less than 30 minutes to create a complete inspection
program including solder inspection. The BX utilizes a standard
package library to simplify training and ensure program
portability across manufacturing lines. Programs created with the
BX are also compatible with Nordson YESTECH’s complete
line of AOI systems.
Advanced Fusion Lighting
™
and newly available 5 megapixel
image processing technology integrates several techniques,
including color inspection, normalized correlation and rule-
based algorithms, to provide complete inspection coverage with
an extremely low false failure rate.
The BX is equally effective for paste, pre / post-reflow and
even final assembly inspection. Remote programming maximizes
machine utilization and real-time SPC monitoring provides
a valuable yield enhancement solution.
Features:
• 5 megapixel color imaging
• 1 top-down and 4 side angle cameras
• Quick set-up
• High speed
• High defect coverage
• Low false failure rate
Automated Inspection for:
• Solder defects
• Lead defects
• Component presence and position
• Correct part / polarity
• Through-hole parts
• Paste
BX Benchtop AOI
Benchtop automated PCB inspection
Nordson YESTECH
USA Headquarters:
2762 Loker Ave. West
Carlsbad, CA USA 92010
+1.760.918.8471 Phone
+1.760.918.8472 Fax
Asia:
#137 Guoshoujing Road
Zhangjiang Hi-Tech Park
Pudong,
Shanghai 201203, P.R.China
+86.21.3866.9166 Phone
+86.21.3866.9199 Fax
Europe:
Bergerstraat 8
6226 BD Maastricht
The Netherlands
+31.352.4466 Phone
+31.352.7722 Fax
UK
Charwell House
Wilsom Road, Alton
Hampshire, UK GU34 2PP
+44 (0) 1420 540254 Phone
+44 (0) 1420 544098 Fax
Nordson YESTECH
USA Headquarters
2762 Loker Ave. West
Carlsbad, CA USA 92010
+1.760.918.8471 Phone
+1.760.918.8472 Fax
www.nordsonyestech.com
Specifications
Model
BX Multi-function system with top-down viewing,
5 meg
apixel camera
Optional Upgrade: 4 side angle cameras
Inspection Capabilities
Throughput: Up to 10 sq. in./sec. > 500,000 components per hour
Maximum Board Size: 18” x 20” (457mm x 508mm)
Clearance: 2” (50mm) top and bottom
Minimum Component Size: 0201; 01005 with high magnification option
Defects Detected: Part: position, missing, wrong, polarity,
skew, tombstone
Lead: bent, lifted, bridging
Solder: open, insufficient, short, solder balls
Software
Algorithms: Color, OCV, OCR, barcode recognition, both image and
rule-based algorithms
Data Requirements: ASCII Text, X-Y position, part #, ref. #, polarity
CAD Translation Package: Aegis, Unicam, Fabmaster, YESTECH CAD Utility
Programming Skill Level: Technician or operator
Operating System: Windows 7
Off-line Software: Optional - Rework, Review and Program Creation
SPC Software: Optional - Real-time local and remote monitoring of first
pass yield, defect trends, and machine utilization.
Data Outputs: Text, SQL, ODBC, MS Access
Hardware
Lighting: Proprietary Fusion Lighting
™
multiangle LED
Imager: 5 megapixel color camera
Resolution 2448 x 2048; 25, 12 or 8 micron pixel size
Facilities
Power: 110-220 VAC, 50/60 Hz, 10 amps
Footprint: 34” x 39” x 17” (864mm x 991mm x 432mm)
Weight: 170 lbs (77 kg)
Machine Installation: < 1 hour
BX Benchtop AOI Benchtop automated PCB inspection