Hybrid-MCM-SIP-specifications.pdf
T echnical specifications Maximum output per hour 165 k 99 k (121k IPC 9850A) (79k IPC 9850A) Maximum output per hour for 10.5 - 16 kcph with dipping 10.5 - 16 kcph with dipping flip chip bonding (IPC 9850) 13.5 - 27 kcp…
Technical specifications
Maximum output per hour 165 k 99 k
(121k IPC 9850A) (79k IPC 9850A)
Maximum output per hour for 10.5 - 16 kcph with dipping 10.5 - 16 kcph with dipping
flip chip bonding (IPC 9850) 13.5 - 27 kcph without dipping 13.5 - 27 kcph without dipping
Placement quality < 1 dpm < 1 dpm
Placement accuracy @ CpK1 25 mm for passives 25 mm for passives CPR/SPR
18 mm for QFP/BGA/FC 18 mm for QFP/BGA/FC SPR/TPR
7 mm for flip chips
1
7 mm for flip chips
1
TPR
Minimum component size 0.25 x 0.125 mm (0201m) 0.25 x 0.125 mm (0201m)
Maximum component size 45 x 45 mm (1.77 x 1.77”) 45 x 45 mm (1.77 x 1.77”)
Maximum component height 10.5 mm (0.41”) 10.5 mm (0.41”)
- Optional 12 mm (0.47”) 12 mm (0.47”)
Placement force range 0.5 to 8 N 0.5 to 8 N
Maximum board size:
- Standard 515 x 390 mm (20.28 x 15.35”) 475 x 390 mm (18.7 x 15.35”)
- Optional 800 x 457 mm (31.5 x 18”) 800 x 457 mm (31.5 x 18”)
Minimum board size:
- Standard 50 x 50 mm (2 x 2”) 50 x 50 mm (2 x 2”)
- Optional 50 x 25 mm (2 x 1”) 50 x 25 mm (2 x 1”)
Board thickness:
- Standard 0.3 to 6 mm (0.01 to 0.24”) 0.3 to 6 mm (0.01 to 0.24”)
- Optional ≥ 0.05 mm ≥ 0.05 mm
Automatic toolbit exchange Nozzles Nozzles
Maximum tape feeding positions (8mm):
Single lane feeders 130 76
Twin tape feeders 260 156
Feeding options Tape, waffle pack, tray, wafer, others Tape, waffle pack, tray, wafer, others
(special feeders on request)
Footprint excl. feeders (LxW) 3,720 x 1,705 mm (146.46 x 67.13”) 2,760 x 1,705 mm (108.66 x 67.13”)
1
Based on K&S Metrology @ 3 sigma
For extended specifications, not specified in these tables, please call your local Kulicke & Soffa contact.
Sept. 2020
Hybrid 5 MCM & SIP
Hybrid 3 MCM & SIP