PCB-1600-Plasma-System-NordsonMARCH-Ltr.pdf

 PCB-1600 Plasma System Features and Benefits  Updated design and interface, combines features from both PCB and VIA ™ series plasma systems  Accommodates multiple panel sizes within a small footprint to consume minim…

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PCB-1600 Plasma System
Features and Benefits
Updated design and interface, combines
features from both PCB and VIA
™
series
plasma systems
Accommodates multiple panel sizes within
a small footprint to consume minimal floor
space
Cross-pumping configuration ensures
even distribution of gas throughout the
plasma chamber for enhanced process
uniformity
Temperature controlled cooling loop
integrated into electrodes delivers highly
repeatable results
Designed to Meet Mid-to-High Production
Requirements
The completely redesigned PCB-1600 system maintains a
perfect balance between its predecessor and its successor,
the ProVIA
™
plasma system. The chamber is still purely
PCB series inspired, but everything else has adopted VIA
series technology – ranging from the user interface to the
PLCs to the controllers.
By sharing similar components and interface, Nordson
MARCH is making it easier for customers to transition
between plasma systems used in the treatment of PCB
panels. The PCB-1600 system offers medium sized
businesses or large R&D institutes the ability to process a
high-mixture products.
The PCB-1600 system is self-contained, and requires
minimal floor space. The chassis houses the plasma
chamber, control electronics, 40 kHz RF generator, and
automatic matching network. Maintenance access is
available from either front or rear access panels.
The plasma chamber is constructed of high-quality
aluminum for superior durability. The plasma chamber is
designed to process PCBs in 8 separate plasma cells in
order to deliver high etch rates together with excellent
treatment uniformity.
Desmear, Etch Back, and Surface Activation
Capability for a Wide Range of Materials
The PCB-1600 system can process rigid and flexible PCB
panels of various shapes and sizes, and is suitable for both
through hole and blind via applications. The cross-
pumping technology disperses the process gases evenly
throughput the chamber, improving process uniformity
and repeatability.
High Etch Rates with Superior Process
Uniformity
The system is designed to accommodate a wide range of
process gases to meet every customer’s specific
requirements (typical process gases may include Ar, O2,
N2, and CF4).
Three (3) electronically-controlled mass flow controllers
(MFCs) are standard, which enable optimal gas control. An
additional two (2) MFCs are available as an option.
Specifications: PCB-1600 Plasma System
For more information, speak with your local representative or contact your regional office.
North America
Headquarters
Concord, CA
+1.925.827.1240
China
Shanghai
+86.21.3866.9166
EMEA
Maastricht,
Netherlands
+31.65.155.4996
S.E. Asia
Singapore
+65.6796.9500
Korea
Seoul
+82.31.736.8321
Taiwan
New Taipei City
+886.2.2902.1860
India
Chennai
+91.44.4353.9024
www.nordsonmarch.com info@nordsonmarch.com
Published 2015-03-14
Enclosure
Dimensions
W x D x H – Footprint
3994W x 3134D x 2460H mm
(157W x 123D x 97H in.)
Net Weight
1362 kg (3003 lbs)
Chamber Number of Available Cells
8
Electrodes
Configuration
Temperature Controlled Power-Power
Working Area
1168D x 685H mm; (46D x 27H in.)
RF Power
Standard Wattage
5 kW
Optional Wattage
10 kW
Frequency
40 kHz
Gas Control
Available Flow Volumes
500, 1000, 2000 or 5000 sccms
Maximum Number of MFCs
5
Control Interface
PLC Control with PC-Based Touch Screen Interface
Vacuum Pump
Standard Dry Pump
63 cfm
Cooling Water Flow
5 slm
N2 Pump Purge Flow
14 slm
Standard Booster Pump
550 cfm
Facilities
Power Supply
208 VAC, 50 A, 3-Phase + Ground; 50/60 Hz
Process Gas Fitting Size & Type
6.35 mm (0.25 in.) Swagelok
Process Gas Purity
CF4 = 99.97%; O2 = 99.996%; N2 = 99.99%;
Ar = 99.999%; H2 = 99.999%
Process Gas Pressure
1.03 bar (15 psig) min. to 1.38 bar (20 psig) max., regulated
Purge Gas Fitting Size & Type
6.35 mm (0.25 in.) Swagelok Tube
Purge Gas Purity
N2 = 99.99%
Purge Gas Pressure
1.03 bar (15 psig) min. to 1.38 bar (20 psig) max., regulated
Pneumatic Valves Fitting Size & Type
6.35 mm (1/4 in.) Swagelok
Pneumatic Gas Purity
CDA, Oil Free, Dewpoint ≤7°C (45°F), Particulate Size <5 µm
Pneumatic Gas Pressure
5.52 bar (80 psig) min. to 6.89 bar (100 psig) max., regulated
Exhaust
NW 40 @ Utility Panel
Compliance
USA
EH&S/Ergonomics
International
CE Marked
Ancillary
Equipment
Gas Generators
Nitrogen, Hydrogen
(requires Additional Non-Optional Hardware)
Facilities
Chiller, Scrubber, Transformer