Brochure-K3D-Series_EN_Rev06-2017-12.pdf
The 3D A OI solution f or demanding applications Actual images from K
The 3D AOI solution for
demanding applications
Actual images from K
Expanding defect coverage boundaries
using a powerful 3D AOI technology
Lifted lead
Bridge Tombstone
High resolution camera with fully
telecentric lens
High quality RGB image for inspection, portability
& review
High performance 3D sensor
Vertical laser beam to avoid projection shadow
2 x high-speed cameras to collect data from two
angle views
Optimized angle to minimize intrinsic shadow
eect
Adaptive height ltering to adapt 3D sensor
sensitivity to component geometry
High precision motion system
3 x linear motors for high speed accurate motion
0.5µm resolution optical encoders for accurate
positioning
Complete defect coverage
Pin height measurement
Coplanarity
Tombstone
Comprehensive defect
coverage
Component body
Missing component
Misplacement (X, Y, Z, θ)
Tombstone
Polarity
Coplanarity
Upside-down component
OCR, OCV
Solder joint
Missing joint, solder excess
Bridging
Lifted lead
Head-in-pillow
Metrology
Full critical measurement
capability (X, Y, Z, θ)
Foreign materials
The choice of
Industry leaders
Up time superior to 99.5%
Very low false calls and
escapes rate down to 50 ppm in
production
X, Y GRR << 4% on 01005
Inspection time up to 100 cm
2
/s
Fast programming time
Compatibility with existing
K Series libraries
LibraryPro to guarantee
performance over time
Full program machine to machine
portability
GPU based processing
100% oine programming and
tuning capabilities
High precision optical
metrology system
Shadow-free 3D sensor
12-bit – 8 M Pixel CCD camera
Telecentric lens
LED lighting with holographic
diuser
High precision linear motors,
1 µm repeatability, with linear
optical encoders
X,Y resolution 4.75µm (sub-
pixel technology)
Z constant resolution 1 µm
overs 20mm Z range
+/- 5mm warpage
compensation with full Z
accuracy
Vectoral Imaging pattern
matching
Coverage Performance Accuracy
Actual images from K