00198763-02_VD_SIPLACE_Pro_17.1_R20-1_EN_DE.pdf
SIPLACE Pro 17.1 (R20 - 1) Software V ersion Description SIPLACE Pro 17.1 (R20 - 1) Software - V ersionsbeschreibung Ausgabe 05/2020 Edition
SIPLACE Pro 17.1 (R20-1)
Software Version Description
SIPLACE Pro 17.1 (R20-1)
Software-Versionsbeschreibung
Ausgabe 05/2020 Edition
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ASM Assembly Systems GmbH & Co. KG Artikel-Nr.: 00198763-02
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81379 München
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SIPLACE Pro 17.1 (R20-1) / Version Description 05/2020 Edition
3
Contents
1 Introduction 5
1.1 System Overview .............................................................................................. 6
2 Scope of Delivery 7
2.1 Packages .......................................................................................................... 7
2.2 Languages ........................................................................................................ 7
2.3 Licenses ............................................................................................................ 8
3 Prerequisites 10
3.1 Supported Station Software Versions and Machine Types .............................. 10
3.2 Supported DEK Printer Software Versions and Printer Types .......................... 12
3.3 Supported Feeder Types ................................................................................. 12
3.4 List of Hidden Unused Hardware Types .......................................................... 14
4 Features of SIPLACE Pro 17.1 17
4.1 SIPLACE TX2 micron V2, SIPLACE TX2i micron V2, TX2 V2 HD and
TX2i V2 HD Supported .................................................................................... 17
4.2 ASM Printer Programming 2.0 Supported ........................................................ 17
4.3 Verifying Vacuum Tooling by Barcode Fiducial ................................................ 18
4.4 Handling of Critical Pairs in High Density Placement ....................................... 20
4.5 Selecting Accuracy Per Component Placement Position ................................. 22
4.6 Configuring Settings for Sensitivity of Nozzle Verification ................................ 22
4.7 Measuring Component Position Before Initial Pickup ...................................... 23
4.8 Inspecting Components After Placement at Too High Speed
– Enhancements ............................................................................................. 24
4.9 Avoiding Nozzle Collisions on CPP Placement Heads ..................................... 24
5 Features of SIPLACE Pro 17.0 25
5.1 Board Editor / Grid Board Editor – Enhancements ........................................... 25
5.2 New License “Single Component Traceability from Wafer
– Machine Connection” .................................................................................... 26
5.3 Smart Pin Support for TX V2 – Enhancements ................................................ 26
5.4 New Fiducial Type “Edge” ............................................................................... 26
5.5 ASM Production Planner in SIPLACE Pro Optimizer Toolkit ............................ 26
5.6 New Nozzle Types for C&P20 P, C&P20 P2, and CPP Heads ........................ 27
5.7 Changes of Nozzle Length for Nozzle 2204 ..................................................... 27
5.8 OSC Package - Enhancements ....................................................................... 27
5.9 Placement Improvements – Automatic Pin 1 Recognition ................................ 27
5.10 Automatic Pitch Detection ............................................................................... 28
5.11 Changing Users for a Running SIPLACE Pro Desk Session............................ 28
6 Restrictions 29
7 Troubleshooting 31
7.1 Problems and Solutions ................................................................................... 31
8 Appendix 32
8.1 ASM Error Reporter Service ............................................................................ 32