PyramaxVacuum-DataSheet-Revision-03-06-Web.pdf

Pyramax Technology to Eliminate Solder V oids The Pyramax Vacuum reﬂow oven has been designed for inline processing of PCB assem- blies or products that require low solder voiding for critical performance applications. H…

Pyramax Technology to Eliminate Solder Voids

The Pyramax Vacuum reﬂow oven has been designed for inline processing of PCB assem-

blies or products that require low solder voiding for critical performance applications. Heat

dissipation applications such as thermal pads on SMT components can beneﬁt from vacuum

processing resulting in reduced solder voids, improved thermal transfer and increased yield.

The system has been designed with the requirements of large EMS, OEMs and high-volume

automotive segments in mind. Processing temperatures of up to 350°C can be achieved

with vacuum levels as low as 1 Torr. Integrated controls and fully automatic vacuum opera-

tion is achieved via BTU’s proprietary WINCON™, Windows™-based control system. The

system has a maximum processing width of up to 457 x 457 mm (18 x 18 inches).

Speciﬁcations*

Model Pyramax125N

Temperature Ratings:

Process Chamber 350°C

Vacuum Chamber 300°C

Convection Heated Zones 10 top and bottom

Vacuum Chamber Internal 1 top radiant panel heater

Vacuum Chamber Heat Assist 2 heated convection zones

Conveyor System edge rail support

Vacuum Chamber Zones 1 zone

Vacuum Chamber Size up to 457 x 457mm (18 x 18 inches) PCB

Vacuum Speciﬁcations:

Vacuum Level 20 Torr (1 Torr optional)

Pump Down Time 15-20 seconds (typical)

Hold Time 10-60 seconds

Reﬁll Time 15 seconds (typical)

Atmosphere nitrogen / air

* All speciﬁcations are subject to change without notice

Key Beneﬁts

• Solder voiding to <5%

• Thermal uniformity +/- 2°C

• Superior proﬁle control

• Full MES integration

• Lowest liquidus time

Key Features

• Recipe controlled

vacuum parameters

• Bell Jar vacuum

chamber design

• Vacuum chamber

process heating

• Easy maintenance access

• Pass-thru mode

• Proﬁle Guardian ready

LEARN MORE

Scan to download the complete presentation on the

operation of the Pyramax Vacuum reﬂow oven including

voiding data generated at the Advanced Process Lab.

To contact BTU please go to www.btu.com/support-contact-sales.htm

• Fully accessible design for

maintenance and serviceability

• Bell jar type chamber mechanism

for reliable vacuum sealing and

trouble-free operation

• High precision optical sensors

used for product tracking and

automatic sensing operations

• Stand-alone, oil-free vacuum

pump system

Traditional Reﬂow Vacuum Reﬂow

What is solder voiding?

Voiding occurs when ﬂux or solder paste oxidation is

entrapped in the solder joint. There may be several

contributing factors to solder voiding. The solder paste

formulation, ﬂux type, pad design, size of the pad, thermal

proﬁle and stencil design are examples of contributing

factors. A common voiding area is in thermal pads. Shown at

right is an MFL processed with and without vacuum reﬂow.

BTU’s vacuum reﬂow solution is designed to reduce voiding

to <5% (process dependent).

Vacuum Chamber

Headquarters | United States

BTU International, Inc

23 Esquire Road

North Billerica, MA 01862, USA

T 1-978-667-4111

F 1-978-667-9068

E btuhq@btu.com

Asia Pacific

BTU Shanghai, China

T +86-21-58669098

F +86-21-58669231

E btuasia@btu.com

Europe

BTU Europe Ltd., UK

T +44 (0) 1252 660010

F +44 (0) 1252 660011

E sales@btu.co.uk

Revision 03, 2019