SJ402DCB1-05E_1.0.0_mail.pdf
In li ne 3D - CT Aut om at ed X -ray In spec ti on S yst em fo r In sul at ed Ga t e Bipo la r T rans isto r s ( IGB T s ) 3Xi-M200 Global Network https://www.sakicorp.com/en/ Headquarters DMG MORI T okyo Digit al Innova…
Inline 3D-CT Automated X-ray
Inspection System for Insulated Gate Bipolar Transistors (IGBTs)
3Xi-M200
Global Network
https://www.sakicorp.com/en/
Headquarters
DMG MORI Tokyo Digital Innovation Center
3-1-4, Edagawa, Koto-ku, Tokyo, 135-0051, Japan
TEL: +81-3-6632-7910 FAX: +81-3-6632-7915
Saki Corporation
Model 3Xi-M200
Resolution 25μ - 80μ
Target PCB Size
mm (in.)
50W x 140L - 360W x 330L
(1.97W x 5.52L - 14.17W x 12.99L)
50W x 140L - 360W x 510L ※
(1.97W x 5.52L - 14.17W x 20.07L)※
PCB Thickness 0.8mm - 4.0mm (0.031 - 0.157 in.)
PCB Warpage 2mm (0.08 in.) or less
PCB Clearance
TOP: 60mm (2.36 in.)
Bottom: 40mm (1.57 in.)
Inspection
Categories
Chip Type Parts, Diodes,
Tantalum Capacitors,
Aluminum Electrolytic Capacitors,
Module chips, Transistors,
Power Transistors, Connectors, QFP, SOP,
CSP, QFN, and BGA
Detector 12bit 1M Pixel
X-ray Tube 200kV 30W Open X-ray tube
X-ray leakage 0.5μSv/h or less
Conveyor Method Flat belt transfer
Conveyor Height 880-920mm (34.65-36.22 in.)
Width Adjustment Auto Width Adjustment
Operating System
Windows 10 IoT Enterprise2019 EMB 64bit
(Microsoft)
Electric Power
Requirement
Three - Phase ~ 200 +/-10%, 50/60Hz
Power Consumption 4.2kVA
Air Requirement 0.5 MPa, 20 L/min (ANR)
Usage Environment 15°C - 28°C / 15 - 80%RH (Non-condensing)
Noise Level 70.0dB or less
Dimensions
W x D x H (Main body)
1400 × 2580 × 1862mm
(55.12 x 101.58 x 73.31 in.)
Weight (Main body) 5,100 kg (11243.58 lbs)
Dimensions Hardware / Function Specications
■
Front View
■
Side View
© 2021 Saki Corporation. All Rights Reserved.
Specifications contained in this Brochure are subject to change without notice.
This brochure was made out in March 2021.
SJ402DCB1-05E
(1862 mm)
(2300 mm)
(2165 mm)
(2580 mm)
(370 mm)
(659 mm)
(1400 mm)
(1000 mm)
(900 mm)
(2165 mm)
(2580 mm)(659 mm)
(608 mm) (1318 mm) (654 mm)(370 mm)
(724 mm)
(1862 mm)
(2300 mm)
(2165 mm)
(2580 mm)
(370 mm)
(659 mm)
(1400 mm)
(1000 mm)
(900 mm)
(2165 mm)
(2580 mm)(659 mm)
(608 mm)
(1318 mm) (654 mm)(370 mm)
(724 mm)
※ with applying the two-step imaging option
2 3
The Ultimate
in Inspection Speed
and Accuracy.
• Small and lightweight 1,400mm wide and 5,100kg
• Saves manufacturing oorspace, enables easy
installation, and improves production-line
operation
• The platform handles board sizes of 50 x 140mm
(W x L) to 360 x 330mm (W x L)
• For larger 360 x 510mm (W x L) boards, 2-step
image capture is available
• The machine’s cast iron frame maintains the
rigidity needed for stable operation
• Extremely high positioning accuracy is achieved
by optimizing motor power with a double motor-
driven system with a high-precision linear scale
manufactured by Magnescale Co., Ltd.
• Saki’s original PCT technology algorithm has
been optimized to improve image capture speed
by 30%, reducing production-line takt time
• Saki’s unique powerful 200keV high-precision
X-ray imaging and 3D reconstruction penetrate
the heat sink’s multiple layers for clearer images
• Newly developed detector enables high-
sensitivity imaging and expands the field of view
(FOV)
• Updated 3D-CT reconstruction processing
software
• Linking the hardware and software with an
automated inspection algorithm optimizes
inspection for a clearer, more reliable image with
less noise
• Saki’s unique “Planar CT Technology” analyzes the internal structures of planar objects. The detector
moves parallel with the planar object capturing images from various directions, thereby enabling quick
and accurate generation of the tomogram of the planar object. This unique parallel movement permits
repeated correction of the reflected images to create a high-resolution image, utilizing less images.
Merit
3
High precision inspection with clear, high-quality images for IGBTs
Merit
1
Lightweight, rigid structure in
a small footprint
Merit
2
High accuracy and speed
About
30%
Weight saving
Weight
4.10m
2
2.97m
2
About
25%
Space saving
Footprint
Saki's unique "Planar CT"
technology generates high-
precision 3D inspection
data
Head in Pillow
Slice
Less Solders
Slice
Existing System
New AXI
NG Defective
Image Improvement
Inspection Image
X-ray transmission image
Planar CT image DBC solder layer