Ersa-VERSAFLOW-4-en.pdf
Ersa V ER SA FLOW 4/ 5 5 Making t he b est even bet ter! The ne x t ge n era tio n o f V ER SA FLOW
Ersa VERSAFLOW 4/55
Making the best even better!
The next generation of VERSAFLOW
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Ersa VERSAFLOW 4/55
Fit for the future of selective soldering
Highlights
Max. PCB size 508 x 508 mm
Fluxer Y variable
Power convection
Dual pot Y-Z variable
Automatic nozzle activation
ERSASOFT 5
VERSAFLEX
VERSACAM
The world’s leading inline selective
soldering system VERSAFLOW meets
the highest demands in flexibility and
throughput. The Ersa VERSAFLOW
4/55 is the 4
th
generation of the
leading inline selective soldering sys-
tems, built to match production re-
quirements from high volume, low mix
to high mix, low volume.
New innovative features make the
VERSAFLOW 4/55 fit for future de-
mands. With almost endless possibili-
ties of configurations, the modular
system can ideally be custom-fitted
to any requirement. Up to 4 spray
heads can be installed in the flux
modules of the VERSAFLOW 4/55.
Flux application is controlled by a la-
ser system. This enables a safe auto-
mated production.
Apart from infrared emitters and con-
vection heaters, the heating module
can also be equipped with the new
power convection heating ensuring an
efficient, safe and homogenous
warm-up of even most complex PCBs.
The machine configuration of the
VERSAFLOW 4/55 may include up to
3 solder modules with one or two sin-
gle wave pots per soldering module.
The new VERSAFLEX solder module
drives the system flexibility to com-
pletely new dimensions.
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VERSACAM
VERSAFLEX soldering module
Basic configuration
Roller conveyor
Side fixing in flux module
ERSASOFT 5
Precision spray flux system with spray test function and flux level monitoring
Lower IR preheater
Maximum PCB size 508 x 508 mm
PC control with touch screen monitor
Process visualization including solder protocol, process data writer, monitoring
function, maintenance and error message indication, password protection
Exhaust air monitoring
Solder bath with electromagnetic solder pump
Solder level- and solder wave height monitoring
Dual pot Y-Z variable
Power convection Fluxer, Y variable
Automatic nozzle activation
ERSASOFT 5
The completely new, intuitively opera-
ble system software ERSASOFT 5 is
based on the newest Microsoft tech-
nology and operated via a 24” touch-
screen. It also permits complete pro-
cess monitoring and visualization, and
it reduces the time required to con-
figure process parameters. Complete
process data management, documen-
tation of all process- and system rel-
evant data as well as an interface for
the integration of traceability as per
ZVEI protocol respectively MES sys-
tems are important features.