IConn-PLUS-ELA-22072019.pdf

IConn PS PLUS TM ELA (Extended Large Area) is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need — for Wire B…

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IConn
PS
PLUS
TM
ELA (Extended Large
Area) is the new State-of-the-Art in Fully
Automatic Wire Bonding. With its upgraded
and enhanced subsystems, it is engineered
to deliver all the capability you will need —
for Wire Bonding today, PLUS tomorrow.
To meet all leading edge wire bonding
challenges, the IConn PLUS ELA was
designed with new capabilities, and also
has extended bondable area to 90 mm on
the Y-axis. There are new features in five
key focus areas:
▪ Process Robustness
▪ Production Portability
▪ Ease of Use
▪ Robust Hardware Performance
▪ Upgradeability
The Power Series of
Semiconductor Assembly
Equipment from K&S has
established itself as the
leading capability in
package assembly. These
products reinforce two key
principles, the Powerful
performance built into
these products, and the
Power of K&S as the
Technology Leader of its
market space for more
than five decades.
The Power Series has set
new standards for
performance, productivity,
upgradeability, and ease of
use. The technical success
and customer acceptance
of the Power Series of
products since their
introduction are evidence
of the K&S continued
commitment for providing
products with the Power to
handle not only today’s
most challenging
packaging applications,
but also tomorrow’s.
From K&S —
the most Powerful name in
Package Assembly
Features
▪ Extended bond area of 56 mm x 90 mm
▪ Upgraded Control System that provides the
latest available technology
▪ +/- 2.0 μm accuracy
▪ High Performance X-Y-Z motion control
system
▪ Dual-frequency transducer allows two
selectable frequencies for each bond
▪ Power Series Advanced Loop for tight
control of the last kink height
▪ On-board process optimization tools
▪ 1pF Auto-BITS self-teach and optimization
▪ WAVI (Wide Angle Vertical Illumination)
system with programmable red and blue
lighting
▪ Optional programmable focus with a full
2.5 mm focus range
▪ Optional copper wire bonding kit
For Bonding Today...
Tomorrow
For sales, service and manufacturing locations, visit www.kns.com
© 2019 Kulicke & Soffa Industries Inc. Specifications may change without notice.
The K&S logo and Kulicke & Soffa are trademarks of Kulicke & Soffa Industries, Inc.
BB-019-07/2019 (rev)
Power Series
Wire Bonders include:
User interface that retains
the familiar K&S look and
feel; minimal training
needed to become familiar
with new performance
enhancing and productivity
increasing features
CE Certification
Semi S2 Safety
Certification*
Semi S8 Ergonomic
Certification*
Semi E10 Compliance for
Run Time Statistics and
MTBA /MTBF calculations
Upgradeability with
Power Pack Upgrade Kits
Programmable Power
Supply System to bond
through factory power
spikes or dips
Industry leading K&S Tray
and Gripper Magazine
Handling system
Full KNet PLUS
compatibility and readiness
* Tested to SEMI S2-0706
(Environmental, Health, and
Safety Guideline for
Semiconductor Manufacturing
Equipment) and S8-0705
(Safety Guidelines for
Ergonomics Engineering of
Semiconductor Manufacturing
Equipment)
WIRE BONDING CAPABILITY
Ultra Fine Pitch for Au Wire
35 μm inline @ 3 sigma
Bonding Area
X Axis: 56 mm
Y Axis: 90 mm
Total Bond Placement Accuracy
2.0 μm @ 3 sigma
Pattern Recognition/Optics/Vision
Progressive Scan Vision Engine
CCD Video Camera
▪ Dual Magnification Optics (2x & 6x)
▪ Optional Programmable Focus for High Magnification
Standard User Processes
Compatible with all Legacy Processes
Power Series Advanced Loop
Power Series Low Loop
Compatibility
Power Series bond programs are upwardly compatible with the
IConn PLUS models - optimization on the newer bonder is
recommended for full performance.
Process Programs are NOT backward compatible. Programs
taught on a new bonder model will not run on an older model.
LOOPING CAPABILITY
Maximum Wire Length
7.6 mm with 1.0 mil wire
3.0 mm with 0.6 mil wire
Minimum Loop Height
Ultra-low loop with Power Series Low Loop
40 μm with 0.6 mil wire
Wire Sway
Wire length < 2.54 mm: 25 μm @ 3 sigma
Wire length > 2.54 mm: ± 1 % wire length @ 3 sigma
SET UP & CONVERSION TIMES
Same Leadframe Type: < 4 min
(Heat block insert & clamp changes, program load from disk)
Different Leadframe Type: < 8 min
(Leadframe width & length changes, magazine size change,
heat block insert & clamp change, program load from disk)
KNET PLUS ASSEMBLY EQUIPMENT NETWORK
KNet PLUS - improves efficiency and productivity, by monitoring
equipment status in real-time. It collects data and controls process
programs locally or from anywhere on a customer’s network.
Contact your K&S Sales Representative to learn more.
MATERIAL HANDLING CAPABILITY
Package/Leadframe Dimensions
Length: 90 to 300 mm
Width: 25 to 100 mm
Thickness: 0.10 to 0.9 mm
(L/F thicker than 0.9mm will require
optional Flat Boat Kit)
Die Pad Downset: Up to 2.3 mm
Magazine Dimensions
Width: 30 to 106 mm
Length: 95 to 305 mm
(Magazines shorter than 125 mm
require optional short magazine kit)
Height: 50 to 178 mm
Slot Pitch: 1.27 to 25 mm
Max. Weight: 5.22 kg
MAN-MACHINE INTERFACE
Monitor
17” color LCD display
Durable Control Panel
Function keys and dedicated buttons, and
user-friendly mouse.
Industry-Recognized User Interface
Simple pull-down menus. Color-overlays of wire
groups for easy programming and teach.
FACILITY REQUIREMENTS
Minimum Air Pressure
3.52 kg/sq cm (50 psi)
Nominal Air Consumption (flow rate)
185 liters/min @ 4.6 kg/sq cm (6.5 CFM @ 65 psi)
Input Voltage
Standard
200 - 240 VAC; -15 % to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Optional
100 - 115 VAC; -15 % to + 10%
Single Phase 50/60 Hz (± 3 Hz)
Power Consumption
1.6 KVA (nominal), 2.75 KVA (max.)
Footprint
Base machine with MHS
889 mm wide x 1009 mm deep (35” x 39.7”)
Weight (estimated)
Machine 590 kg (1300 lbs)
Machine & Crate 670 kg (1477 lbs)