Flexbond_datasheet.pdf
Flexbond Hot Bar Bonding Platform Innovation • Full process solutions including flux transfer, high- accuracy placement and hot bar soldering • Highest-accuracy, flexible placement platform • The first high-throughput au…
Flexbond Hot Bar Bonding Platform
Innovation
• Full process solutions including flux transfer, high-
accuracy placement and hot bar soldering
• Highest-accuracy, flexible placement platform
• The first high-throughput automated hot bar
bonding platform, featuring dual-zone processing
and up to 12 bond heads (4X alternative solutions)
• Advanced hot bar technologies including
programmable heat and pressure control
Advanced flex circuits are a key technology driving the next generation of wearables, mobile devices and
other leading-edge products. The Flexbond™ hot bar bonding platform enables the first fully automated
volume solution for these and other hot bar interconnect applications.
Flexbond leverages a highly parallel bond head architecture and complete process automation to set a
higher standard for volume productivity and accelerate bottom line growth.
LED Backlit Display
Touch Panel
CMOS Camera Lens
Mobile
Flex Circuit
PC/Tablet
Wearable
LCD Panel
Hot Bar Interconnect
Load pallet
with bottom
part
Transfer flux
Place top
part
Transfer to
bonder
Align heads
with parts
Bond parts
together
Hot Bar for volume productivity.
Performance and Value
• Configurable modules support full range of hot
bar applications
• 6X to 12X the throughput of traditional semi-
automated assembly stations
• Twice the throughput of alternative automated
hot bar solutions, 80% less floor space
• Fewer machines required, 30% lower CAPEX
• Lowest OPEX and $/cph/m
2
Fully automated, fully integrated, full-process
Flexbond combines with Universal Instruments’ Fuzion® Platform for full-process integration, including flux
transfer, high-accuracy placement and hot bar soldering.
CHINA, SHENZHEN
Tel. +86-755-2685-9108
AMERICAS
Tel. 1-800-432-2607 or
Tel. +1-607-779-7522
www.uic.com | email: universal@uic.com
CHINA, SHANGHAI
Tel. +86-21-6495-2100
EUROPE
Tel. +421-2-4930-96-60
MC-6419 04/16
©2016 Universal Instruments Corporation. All rights reserved. All specifications are subject to change.
Heating Control
• Programmable temperature settings to align with
required soldering thermal profiles
• Hot bar head with high-fidelity pulse heat for
solder or constant heat for ACF applications
• Controlled under-board constant heat to balance
thermal load for flex-to-flex applications
• Closed-loop temperature control to maintain
precise, consistent performance
Leading-edge technologies
Flexbond incorporates advanced technologies to put you in complete control of your processes.
Pressure Control
• Programmable pressure settings for improved
bonding control
• High-accuracy pressure control to prevent
solder shorts and maintain solder shape
Other
• Conveyor architecture, adjustable width
• Adjustable head positions and planarity
A modern solution for today’s volume demands
Alternative hot bar solutions are no match for the growing market demand for high-end flex circuit products.
Flexbond solutions empower a high-performance volume production model to meet these demands.
Flexbond: 4 lines, 2 operators, ~32 m
2
80% < floor space, 67% < operators
Alternative automated solution:
12 lines, 6 operators, ~160 m
2
Flexbond: 1800 UPH, 1 operator
12X output, 92% < operators
Semi-automated: 150 UPH, 12 operators
FLEXBOND SPECIFICATIONS
Max Bonding Rate 1800 UPH
Carrier Size 100 x 100mm (Min) to 500 x 350mm (Max)
Bond Head Configuration Dual-zone: 3 or 6 heads per zone
Hot Bar Head Heating High-fidelity pulse heat up to 600°C or constant heat up to 200°C
Under-Board Heating Constant heat up to 200°C
Temperature Control Accuracy ±2°C, Cpk>1.33
Pressure Range 0.5 to 12kg
Pressure Control Accuracy ±70g per 1kg
Machine Dimensions (W x D x H) 1350 x 1500 x 2000mm