PILOT-NX-V8-HR-UK.pdf

F L Y I N G P R O B E S Y S T E M T h e P I L O T V 8 H R N EX T > S E RI ES i s b a s e d o n t h e S e i c a V I P p l a t f o r m , w h i c h in cl u de s t he in no v at iv e N EXT > s of tw ar e. T e st p ro g…

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FLYING PROBE SYSTEM
The PILOT V8
HR
NEXT>SERIES is based on the Seica VIP platform, which
includes the innovative NEXT> software. Test program development is
organized in 3 simple steps: “Prepare”, “Verify” and “Test”, where the user is
guided through a series of automated operations in an intuitive, self-explanatory
environment, drastically reducing programming time and minimizing errors and
omissions, ensuring the quality of the final test program.
PILOT V8
HR
NEXT>SERIES
PILOT NEXT>SERIES LINE
Current electronics trend shows a major direction for the board production:
miniaturization. More products have now very small dimensions and the
request of testing becomes more demanding on mechanical aspects than
in electrical measurement difficulties.
What is MEMS Technology?
Micro-Electro-Mechanical Systems, or MEMS, is a technology that in its
most general form can be defined as miniaturized mechanical and electro-
mechanical elements.
The technological challenge, in testing these objects, finds a solution in the
CAD data management expertise, with the target to generate automatically
a test program, starting from a mix of electrical and mechanical information.
The solution for this application is the flying probe technology, integrating
the high accuracy of positioning probes on the UUT and the capability of the
probe to land with a perfect control of the pressure.
Based on the consolidated and complete solution of the Seica Flying Probes
line, the
PILOT V8
HR
NEXT> SERIES includes the performance of a
10 MegaPixel High Resolution camera and a dedicated Z-axes control.
The
PILOT V8
HR
NEXT> SERIES vertical architecture is the optimum
solution for probing both sides of the UUT simultaneously. The reliable and
repeatable dual-side probing increases test accessibility and flexibility, while
guarantees the complete continuity tests from side to side of the UUT.
The vertical architecture represents the unique technology overcoming the
intrinsic limitations of the horizontal systems. The requirement for standard
ICT & Functional testing of the DUT is still part of the basic requirement and
is satisfied using the Seica proprietary hardware: ACL measurement card
with 18 bit resolution and switching matrix allow to reach most the testing
requirement, remaining a solid base for any future expansion capabilities.
The test techniques of the include:
• FNODE signature analysis on the nets of the UUT
• Standard analog and digital in-circuit test
• Vectorless tests (JSCAN and OPENFIX), to test ICs for opens and shorts
• PWMON net analysis for power on the boards
• Continuity test to detect open tracks on the PCB
• Visual tests for component presence/absence and rotation
• Optional Thermal Scan Resources
• ALI: Automatic Laser Inspection for testing the presence / absence of
components and for warpage compensation.
TECHNICAL TABLE
SEICA WORLDWIDE
SEICA SpA
via Kennedy 24
10019 Strambino - TO
ITALY
Tel: +39 0125 6368.11
Fax: +39 0125 6368.99
Email: sales@seica.com
PROXIMA S.r.l.
Email: info@proxima-ate.com
SEICA Inc.
Email: dave.sigillo@seicausa.com
SEICA FRANCE SARL
Email: dupoux@seica.fr
SEICA DEUTSCHLAND GmbH
Email: marc.schmuck@seica.com
SEICA ELECTRONICS
(Suzhou) Co.Ltd.
Email: seicachina@seica.com
Seica reserves the right to change the
technical specifications without notice
TDS Pilot Next> series V8HR vers. 02 UK 05/2018
VIVA NEXT> is available in
a 32 and 64 bit version with a
new graphical interface and a
guided environment for an easy
and quick test program
creation. It is fully integrated
with NI-VISA drivers and with
third-party test management
software.
Probes Position - Test Side Front/Rear
Standard Configuration (Head 2 not available) 6 “Standard Probe” (2 front, 4 rear)
1“High Resolution Probes” (front)
1 CCD HR 10 MegaPixel Color Cameras (front)
Optional Configuration (Head 2 and 6 not available) 4 “Standard Probe” (2 front, 2 rear)
2 “High Resolution Probes” (1 front, 1 rear)
2 CCD HR 10 MegaPixel Color Cameras (front)
Number of CCD view probes Color Cameras 2 (1 front, 1 rear)
Number of Fixed Probes up to 192
Maximum Digital Embedded Channels 4
Marker Recognition Automatic
UUT Planarity Compensation (by Laser) Automatic
Board Clamping System Manual (Dual Action)
Active Test Area 500 x 450 mm (19.68" x 17.72")
Minimum Board Size 20 x 20 mm (0.79" x 0.79")
Minimum Board Thickness 0.3 mm (0.0012")
Maximum Board Thickness 7 mm (0.28")
Maximum Thickness testable 13 mm (0.512")
UUT Clamping Clearance 2 mm (0.08")
UUT Clearance 19 mm Top, 40 Bottom (Standard Configuration)
19 mm Top, 19 Bottom (Optional Configuration)
Universal Carrier Option
(for clamping not-regular shape PCB)
Minimum Pad Pitch 150 µm (6 mil) Standard Electrical Probe
Minimum Pad Size 75 µm (3 mil) Standard Electrical Probe
40 µm (1.6 mil) High Resolution Probe
XY axis resolution (brushless motor) 2.5 µm
Z axis resolution (linear motor) 1 µm
Z-axis Travel -3.0 mm to 40 mm (programmable)
Contact Force: Standard Probe 10 g – 100 g (programmable)
High Resolution Probe 1 g – 13 g (programmable)
Voltage Generator 1 (DRA) DC/AC ±1 mV to ±10 V (±0.1%)
Voltage Generator 2 (DRB) DC/AC ±1 mV to ±10 V (±0.1%)
Voltage Generator 3 (DRC) DC/AC ±25 mV to ±100 V (±0.2%)
Current Generator DC/AC ±1 nA to ±0.5 A (±0.1%)
Waveform Generator 1 (DRA) Sin, Tri, Arbitrary 1 Hz to 3 MHz (±1 mHz), ±10 Vmax
Waveform Generator 2 (DRC) Sin, Tri, Arbitrary 1 Hz to 10 kHz (±10 mHz), ±100 Vmax
Voltage Measurements DC/AC ±200 µV to ±100 V
Current Measurements DC/AC ±3 nA to ±0.5 A
Frequency Measurement 0.1 Hz to 50 MHz
Digital Embedded Channel ±12 V - 500 mA - 10 MHz
Resistance Measurement 1 mΩ to 100 MΩ
Capacitance Measurement 1 pF to 1 F
Inductor Measurement 1 µH to 1 H
Zener Measurement up to 100 V (200V option)
Visual Inspection Automatic
Temperature Range 23°C ± 2°C
Humidity 30 - 80 %
Power Consumption 2.5 kW max (1.0 kW typical)
Air Flow 0.35 CFM – 10 l/min. 0.3 CFM – 6 l/min.
Weight 1400 kg (3086 Ibs)
Depth 1265 mm (49.8”) 2165 mm open doors (85.3”)
Width 1750 mm (68.9”) 3374 mm open doors (132.8”)
Height 1800 mm (70.9”) 2230 mm (87.8”) with light-tower
PC/Operating System Windows 7
Software VIVA
Automatic Test Generation Yes
Autodebug Yes
Data Input Format CAD Data or Manual