150256879.pdf

FasTRAK ™ Plasma System Vers atil e Stri p Pr oces sin g High R eliabi lity Stri p Ha nd li ng T he FasTRAK ™ Plasma System is a fully - automated, high - throughpu t, pla sma treatment system f or lea d - frame strips, …

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FasTRAK
™
Plasma System
Versatile Strip Processing
High Reliability Strip Handling
The FasTRAK
™
Plasma System is a fully-
automated, high-throughput, plasma treatment
system for lead-frame strips, laminate substrates,
and other strip-type microelectronic components.
Measuring 1.65 meters wide by 1.5 meters deep the
FasTRAK Plasma System has a >35% smaller
system footprint than previous strip processing
models. The capability to reuse magazines further
reduces the effective footprint as the empty
magazines do not need to be staged at the system.
Using state-of-the-art robotic movement that
virtually eliminates operator handling of the strips
or magazines, the FasTRAK Plasma System
accommodates the full-known range of magazines
and strip width, length and thickness dimensions.
The FasTRAK System makes it easy to change over
to accommodate a new magazine or strip size -
recipes are software driven and the system requires
minimal hardware interaction or tooling.
The field-proven robotics were specifically designed
to lower the handling risk to sensitive substrate
materials by using minimal movement, pushing,
pulling and low G-forces.
The FasTRAK System features an innovative new
material tracking software application and internal
camera to count the number of strips and track
their progress throughout the entire treatment
process, providing 100% treatment validation. Up
to 10 strips can be accommodated per batch with
an industry leading units per hour (UPH) treatment
rate.
The FasTRAK system also includes a new high-
efficiency, application-specific, plasma chamber that
can be configured for Direct or Ion-Free plasma
modes.
Plasma Processes Include
• Pre-die attach for improved adhesion
• Pre-wire bond for higher pull strength and
CpKs
• Pre-mold to reduce delamination
• Post-mold to remove flash
• Pre-underfill to reduce voiding
Features and Benefits
Flexible configuration accommodates the full
range of strip dimensions and magazine
designs
Advanced robotic handling system minimizes
strip handling, pushing, pulling and reduces
operator intervention
New camera-
based material tracking provides
100% plasma treatment validation
High-efficiency, application specific, plasma
chamber design offers Direct or Ion Free
plasma treatment modes
Significantly smaller system footprint and
magazine reuse capability save space and
help lower cost of ownership
Specifications: FasTRAK
™
Plasma System
Enclosure
Dimensions
W x D x H – Footprint
1650 W x 1500 D x 2100 H mm
(64.96 W x 59.06 D x 82.68 H in.)
Net Weight
909 kg (2000 lb)
Effective Footprint – Clearances
Right, Left, Back – 914 mm (36 in.)
Front – 914 mm (36 in.)
Chamber
Dimensions
330 W x 330 D x 50 H mm
(13 W x 13 D x 2 H in.)
Volume
5.5 liters (338 in³)
Variable Electrode Configurations
Power-Ground; Ground-Power; Power-Power
Electrodes
Powered Electrode Dimensions
325 W x 325 D x 50 H mm (12.8 W x 12.8 D x 2 H in.)
Working Area
305 W x 305 D mm
RF Power
Standard Wattage
600 W
Frequency
13.56 MHz
Gas Control
Maximum Number of MFCs
4
Control
System
PLC Control with PC Based
Touch Screen Interface
Remote
Interface
SMEMA; SECS/GEM
Optional
Vacuum
Pump
Dry vacuum pump
16 CFM
Variable Frequency Drive
Facilities
Power Supply
220VAC, 15A, 50/60Hz, Single Phase, 12 AWG, 3-Wire
Process Gas Fitting Size & Type
.25-in. OD Swagelok Tube
Process Gas Purity
Industrial grade or better
Process Gas Pressure
Regulated from .69 bar (10 psig) min. to 1 bar (15 psig) max.
Purge Gas Fitting Size & Type
.25-in. OD Swagelok Tube
Purge Gas Purity
Industrial grade Nitrogen or CDA
Purge Gas Pressure
Regulated from 2 bar (30 psig) min. to 5.5 bar (80 psig) max.
Pneumatic Valves Fitting Size &
Type
.25-in. OD Swagelok Tube
Pneumatic Gas Purity
CDA, Oil Free, Dewpoint <=7°C /45°F, Particulate Size <5
micron
Pneumatic Gas Pressure
Regulated from 3.4 bar (50 psig) min. to 5.5 bar (80 psig) max.
Exhaust
25.4mm (1 in.) OD Pipe Flange
Vacuum Source
-80 kPa (-23.3 in. Hg)
Compliance
Certifications
CE Marked, SEMI S2/S8 (EH&S/Ergonomics), Cleanroom,
SEMI E-10
Ancillary
Equipment
Optional Equipment
Nitrogen generator, Hydrogen generator (Requires Additional
Non-Optional Hardware), Scrubber
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Dimensions: FasTRAK
™
Plasma System
FasTRAK Plasma System – Front View
FasTRAK Plasma System – Right Side View
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