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1 Introduction, technical data User Manual SIPLACE S -25 HM 1.13 Overview of the modules - placement heads Software Version SR.503.xx 04/2002 US Edition 42 1.13. 4 Structure of the 6-s egment Collec t&Place he ad wit…
User Manual SIPLACE S-25 HM 1 Introduction, technical data
Software Version SR.503.xx 04/2002 US Edition 1.13 Overview of the modules - placement heads
41
All the components are inserted with the same cycle time. Before the component is inserted, it is
measured by the optoelectronic vision module. 1
– The component vision camera creates an image of the current component.
– The precise position of the component is also determined.
– The package form of the current component is compared against the programmed package
form in order to identify it. Any components that cannot be identified are rejected.
– The turning station turns the component to the required placement position.
1.13.2 Description of the 12-segment Collect&Place head
– The 12-segment Collect&Place head works using the "collect & place" principle, i.e. the com-
ponents are held by the nozzles with the aid of a vacuum and, after one complete pick-up cycle,
are placed gently and accurately on the PCB with the aid of forced air. The vacuum in the noz-
zles is also checked several times to determine whether the components were picked up and
set down correctly.
– The "adaptive" sensor stop mode of the z axis compensates for any irregularity of the PCB sur-
face when the components are set down.
– Defective components are rejected and are picked up again during a repair run.
1.13.3 Technical data - 12-segment Collect&Place head
with standard component vision module
1
Range of components 0201 to PLCC44, including BGA, µBGA, flip-chip,
TSOP, QFP, PLCC, SO to SO32, DRAM
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
6 mm
0.5 mm
0.35 mm
0.2 mm
0.6 mm x 0.3 mm
18.7 mm x 18.7 mm
2 g
Maximum stroke of the Z axis 16 mm
Programmable set-down force 2.4 to 5.0 N
Max. placement rate 12,500 components/h
Nozzle types 9xx
Angular accuracy ± 0.70° / 4
σ
Placement accuracy ± 90 µm / 4 σ
1 Introduction, technical data User Manual SIPLACE S-25 HM
1.13 Overview of the modules - placement heads Software Version SR.503.xx 04/2002 US Edition
42
1.13.4 Structure of the 6-segment Collect&Place head
with standard component vision module
1
Fig. 1.13 - 2 Overview of the 6-segment Collect&Place head with standard component vision module
(1) Star with 6 sleeves
(2) Motor for "Reject" valve adjustment drive
(3) Turning station
(4) Standard vision module
(5) Z axis driving mechanism
(6) Star motor
1
User Manual SIPLACE S-25 HM 1 Introduction, technical data
Software Version SR.503.xx 04/2002 US Edition 1.13 Overview of the modules - placement heads
43
1.13.5 Description of the 6-segment Collect&Place head
The functionality of the 6-segment revolver head is similar to that of the 12-segment revolver head.
With its standard vision module, the 6-segment revolver head can quickly and accurately place
ICs with an edge length of up to 32mm x 32mm. It really comes into its own when there is a very
high proportion of ICs in the placement process. The cycle time of the 6-segment revolver head
depends on the dimensions and number of component leads or bumps. 1
1.13.6 Technical data - 6-segment Collect&Place head
with standard component vision module
1
1
Component range 0603 to 32mm x 32mm
PLCC,SO, QFP, TSDP, SOT, MELF,
CHIP, IC, BGA
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
8.5 mm
0.5 mm
0.56 mm
0.32 mm
1.6 mm x 0.8 mm
32 mm x 32 mm
5 g
Maximum stroke of the Z axis 16 mm
Programmable set-down force 2.4 to 5.0 N
Max. placement rate 8xx, 9xx
Nozzle types 8.500 BE/h
Angular accuracy ± 0.4° / 4
σ
Placement accuracy ± 80 µm / 4 σ