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1 Introduction, technical data User Manual SIPLACE S -25 HM 1.14 Overview of the modules - vision modules Software Version SR.503.xx 04/2002 US Edition 44 1.14 Overv iew of the modules - v ision modules Each pla cemen t …
User Manual SIPLACE S-25 HM 1 Introduction, technical data
Software Version SR.503.xx 04/2002 US Edition 1.13 Overview of the modules - placement heads
43
1.13.5 Description of the 6-segment Collect&Place head
The functionality of the 6-segment revolver head is similar to that of the 12-segment revolver head.
With its standard vision module, the 6-segment revolver head can quickly and accurately place
ICs with an edge length of up to 32mm x 32mm. It really comes into its own when there is a very
high proportion of ICs in the placement process. The cycle time of the 6-segment revolver head
depends on the dimensions and number of component leads or bumps. 1
1.13.6 Technical data - 6-segment Collect&Place head
with standard component vision module
1
1
Component range 0603 to 32mm x 32mm
PLCC,SO, QFP, TSDP, SOT, MELF,
CHIP, IC, BGA
Component specification
Max. height
Min. lead pitch
Min. bump pitch
Min. ball/bump diameter
Min. dimensions
Max. dimensions
Max. weight
8.5 mm
0.5 mm
0.56 mm
0.32 mm
1.6 mm x 0.8 mm
32 mm x 32 mm
5 g
Maximum stroke of the Z axis 16 mm
Programmable set-down force 2.4 to 5.0 N
Max. placement rate 8xx, 9xx
Nozzle types 8.500 BE/h
Angular accuracy ± 0.4° / 4
σ
Placement accuracy ± 80 µm / 4 σ
1 Introduction, technical data User Manual SIPLACE S-25 HM
1.14 Overview of the modules - vision modules Software Version SR.503.xx 04/2002 US Edition
44
1.14 Overview of the modules - vision modules
Each placement system has 1
– two component vision cameras on the placement heads and
– two PCB vision cameras on the underside of the X-axis gantries.
The vision analysis unit is located in the control unit for the placement system and the component
vision module is used to determine: 1
– the precise position of the components at the nozzle and
– the geometry of the package form.
The PCB vision module uses fiducials on the PCBs to determine: 1
– the position of the PCB,
– its rotation angle
– and the PCB delay.
The PCB vision module also uses fiducials on the feeder modules to determine the exact pick-up
position of components, which is particularly important for small components. 1
1.14.1 Component vision module (standard camera) on the
12-segment Collect&Place head
1
Fig. 1.14 - 1 Component vision module (standard camera) on the 12-segment Collect&Place head
User Manual SIPLACE S-25 HM 1 Introduction, technical data
Software Version SR.503.xx 04/2002 US Edition 1.14 Overview of the modules - vision modules
45
1.14.2 Technical data - component vision module (standard camera) on the
12-segment Collect&Place head
1.14.3 Component vision module (standard camera) on the
6-segment Collect&Place head
1
Fig. 1.14 - 2 Component vision module (standard camera) on the 6-segment Collect&Place head
Component dimensions 0.6 mm x 0.3 mm up to 18.7 mm x 18.7 mm
Range of components 0201 to PLCC44
including BGA, µBGA, flip-chip, TSOP, QFP
PLCC, SO to SO32, DRAM
Min. lead pitch 0.5 mm
Field of vision 24 mm x 24 mm
Illumination method Front-lighting
(3 levels programmable as required)