MIRTEC_MS-11_3D_SPI_Series_Data_Sheet-REV1.pdf
Exc lu si ve 1 5MP C oa XPr ess C am era Sys te m Dual Projection Shadow Free Moiré Technology Precision Compound Telecentric Camera Lens Automated Z-Height Calibration Sy stem Automated PCB Under B oard Support System P…
Exclusive 15MP CoaXPress Camera System
Dual Projection Shadow Free Moiré Technology
Precision Compound Telecentric Camera Lens
Automated Z-Height Calibration System
Automated PCB Under Board Support System
Precision PCB Warpage Compensation
Closed Loop Communication With Screen Printer
Absolute Repeatability and Reproducibility
INTELLISYS
®
Industry 4.0 Intelligent Factory Automation System
www.mirtecusa.com
PREMIER INSPECTION
Standard Features:
Options:
System Specifications:
Option 1 Pixel Resolution: 15 um 58.56 mm x 58.56 mm (2.31” x 2.31”)
Option 2 Pixel Resolution: 10 um 39.04 mm x 39.04 mm (1.54” x 1.54”)
1,200 Kg (2,645 lbs.)
Robot Positioning System
Precision Closed Loop AC Servo Drive, Resolution: 1 um / Repeatability: ±10 um
Power Requirements
Single Phase 200~240V 50~60Hz; 1.1 KW, Breaker Capacity: 25 Amp
Air Requirements
5 Kgf / cm² (0.5 Mpa); (71 PSI)
Standard: 0.5 mm - 5 mm
PCB Surface Clearance
Top-Side Clearance: 20 mm / Bottom-Side Clearance: 50 mm
PCB Edge Clearance
Top-Edge Clearance: 3 mm / Bottom-Edge Clearance: 3.5 mm
Maximum PCB Warpage
±2 mm
MS-11 3D SPI Series Specifications
Intel
®
Multi-Core PC, 32” Flat Screen LCD Monitor, Windows 10
TM
OS, HDD, Mouse & Keyboard, Network LAN Card.
Three (3) Stage High-Speed Conveyor System with Programmable Width Control and Automatic PCB Support.
Advanced High-Intensity RGB LED Lighting System.
ePM-SPI Gerber Programming Software (One Seat Included with Purchase).
Maximum PCB Weight
Standard: 4 Kg (8.82 Lbs.)
Machine Dimensions and Weight
Vision System (FOV Size)
Dual Projection Shadow Free Moiré Phase Step Image Processing
Lens Configuration
Precision Telecentric Compound Lens Design
Height: ± 1% / Volume: ± 2%
Inspection Height
Maximum: 500 um / Minimum: 40um
PCB Thickness Range
Lighting System
Advanced High-Intensity RGB LED Lighting System.
Inspection Technology
3D Inspection Technology
2D Inspection Technology
15MP CoaXPress Camera System
Additional Specifications
Solder Deposition: Height, Volume / Area, Solder Bridge, X/Y Offset, Shape Deformity, etc.
3D Inspection Item
SVN Multi-System Version Control Software - Requires Separate PC Server.
MS-11U
Auto-Focus Moveable Z-Axis System with Automatic PCB Warpage Compensation.
KTL - Calibration Target Fixture.
Statistical Process Control (SPC) Software (Local System Software).
15MP CoaXPress Top-Down Camera System (See Specifications).
PCB Inspection Area
ePM-SPI CAD Import Software. ODB++ Import Module Sold Separately (Requires ePM SPI).
2D Bar Code Reader Options: Gun Type, Camera Type and External Mount.
Remote PC - Software Purchased Separately.
Total Remote Management Software (TRMS) - Requires Server Software for Remote PC and Client Software on All Machines.
INTELLI-TRACK
®
Process Control Software - Requires Server Software for Remote PC and Client Software on All Machines.
Remote Software: Statistical Process Control (SPC) Software,
60 mm x 60 mm to 660 mm x 610 mm (2.36" x 2.36" to 26.0" x 24.1")
PCB Indexing Mode: 60 mm x 60 mm to 1,320 mm x 610 mm (2.36" x 2.36" to 51.97" x 24.1")
MS-11U
1,270 mm W x 1,680 mm D x 1,500 mm H (50" x 66.14" x 59")
Height Accuracy on Calibration Fixture
± 1%
Height Resolution
±1 um
Repeatability on Calibration Fixture
15MP CoaXPress: (3,904 x 3,904 @ 120 fps)
(Subject to change without prior notice)