HS50_advance_level 2 - 第366页

S tudent Guide HS-50 Ad vanced II 12 S pecial handlin g for th e Z-axis Edition 0 7/2002 22   7 UDYHOSU RILOHVRI WKH= D[L VZKHQ SODF LQJFRPS RQHQW V On the line co mputers the travel profi le for the up a…

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Student Guide HS-50 Advanced II
Edition 07/2002 12 Special handling for the Z-axis
21
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Blast air control at placement:
Value “0” mean the blast air valve don‘t switch on.
 Value “1-50” mean blast air valve is switched OFF when stepper motor valve drive start to
move.
 Value “51-150” mean blast air valve is switched OFF when stepper motor valve drive moved
for 90 degree.
 Value. “151-255 mean blast air valve is switched OFF when stepper motor valve drive moved
for 180 degree.2U
at light barrier top.
No value “----” (from converting 501/502 to 503 format) mean same mode than (existing
standard).
Air kiss control at return component! (not reject)
 Value and description like 
 Value and description like 
 Value. “151-255” mean blast air valve is switched OFF when stepper motor valve drive moved
for 180 degree.
Student Guide HS-50 Advanced II
12 Special handling for the Z-axis Edition 07/2002
22
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On the line computers the travel profile for the up and down motion of the Z-axis can be specified
for the placement operation for each package form.
1RWH
The travel profile specification also includes the special handling for packs of 8 nozzles, i.e. there
is no differentiation between nozzle types anymore on the MC.
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0RGHNormal downward motion with light barrier at bottom
0RGHCreep mode and light barrier at bottom.
The Z-axis moves about 1mm before reaching the target position with V
min
and the forced air is
activated when switching the light barrier at the bottom.
0RGHCurrent sensor
The Z-axis moves with the current sensor pointed down, i.e. the Z-axis presses the component
into the soldering paste with the placing force defined.
0RGHCurrent sensor with creep
The Z-axis moves with the current sensor pointed down, and the system switches to V
min
1 mm
before reaching the target position, and the component is pressed into the soldering paste with
the specified placement force.
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0RGHStandard mode
0RGHCreep mode, i.e. the Z-axis moves up slowly the first few millimeters.
Student Guide HS-50 Advanced II
Edition 07/2002 12 Special handling for the Z-axis
23
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Positional deviation: 200 mV 10 ms 
Iactual: 5 V 10 ms 
Vtarget: 5 V 10 ms 
End signal: 5 V 10 ms 
 about 28 ms Position when moving down to place the component
on the 12th PCB.
 about 12 ms Time on the component to switch on the forced air plus
the system’s reaction time
 about 21 ms Position while moving down
