晶圆测试说明书Cascade-11861-6-Manual.pdf - 第47页
Chapter 2: Station Specifications • 23 11700 G UARDED T HERMAL P ROB E S TA TIONS The 11700 offers the same thermal testing capacity as a 11600, but with an advanced reduced-noise th ermal chuck. Using Cascade Microtech’…
22
• Summit 11K/12K Probe Station User’s Guide
11600 THERMAL PROBE STATIONS
The 11600 provides temperature control of wafers over a -65
o
C to +200
o
C range
(300
o
C on HT version). Since the wafer is enclosed in the low-volume
MicroChamber, temperature transitions are fast. You can verify the calibration at
each temperature level using a Cascade ISS on an integrated auxiliary stage and
Cascade's VNA calibration software.
Chuck Specifications
Total System Planarity
Planarity includes all error sources.
Flatness 2-micron (1 mil) to 130 °C, 51-micron
(2 mil) to 200 °C
Residual capacitance, chuck to shield
(standard version)
< 950 pF
Isolation, chuck to shield > 1 GΩ at 500-volts DC at 25 °C
Breakdown bias voltage > 500-volts
Temperature range
-65 °C to 200 °C maximum (controller
dependent). 300
o
C on HT version.
Temperature uniformity +0.5° C or +0.5%,
whichever is higher
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum controls
Total system planarity <30-micron (1.2 mil) across 101 mm
(4 in.) circle
<40-micron (1.6 mil) across 203 mm
(8 in.) circle
Chapter 2: Station Specifications •
23
11700 GUARDED THERMAL PROBE STATIONS
The 11700 offers the same thermal testing capacity as a 11600, but with an
advanced reduced-noise thermal chuck. Using Cascade Microtech’s patented
FemtoGuard thermal chuck technology, the 12700 provides wafer temperature
control in a reduced noise and capacitance environment. Chuck noise is reduced
1000-times over standard thermal chucks. The noise on topside probes reduces to
fA levels.
Chuck Specifications
Total System Planarity
Planarity includes all error sources.
Flatness 25-micron (1 mil) to 130 °C, 51 micron (2
mil) to 200 °C
Residual capacitance, chuck to
shield
< 50 pF
Capacitance variation over chuck
surface
≤ 30 fF
Isolation, chuck to shield > 1 TΩ
Breakdown bias voltage > 500-volts
Chuck leakage current, thermal
chuck on
0 to 100-volts: < 50 fF
Chuck leakage current, thermal
chuck off
0 to 100-volts, 20 fF
Temperature range
-65 °C to 200 °C maximum (controller
dependent). 300
o
C on HT version.
Temperature uniformity +0.5 °C or 0.5% whichever is higher
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control
Total system planarity <30-micron (1.2 mil) across 101 mm
(4 in.) circle
<40-micron (1.6 mil) across 203 mm
(8 in.) circle
24
• Summit 11K/12K Probe Station User’s Guide
11800 GUARDED THERMAL PROBE STATIONS
The 11800 offers the same thermal testing capacity as an 11700, but with an
advanced reduced-noise thermal chuck. Using Cascade Microtech’s patented
FemtoGuard thermal chuck technology, the 12700 provides wafer temperature
control in a reduced noise and capacitance environment. Chuck noise is reduced
1000-times over standard thermal chucks. The noise on topside probes reduces to
fA levels.
Chuck Specifications
Total System Planarity
Planarity includes all error sources.
Flatness 25-micron (1 mil) to 130°C, 51-micron
(2 mil) to 200°C
Residual capacitance, chuck to shield 1 pF
Capacitance variation over chuck
surface
3 fF
Isolation, chuck to shield > 1 TΩ
Breakdown bias voltage > 500-volts
Chuck leakage current, thermal
chuck on
0 to100-volts: < 50 fA
Chuck leakage current, thermal
chuck off
0 to100-volts, 20 fA
Temperature range
-65 °C to 200 °C maximum (controller
dependent). 300°C on HT version.
Temperature uniformity +0.5 °C or 0.5% whichever is higher
Vacuum distribution area 13, 75, or 152 mm (selectable)
Auxiliary chucks Two with individual vacuum control
Total system planarity <30-micron (1.2 mil) across 101 mm
(4 inch) circle
<40-micron (1.6 mil) across 203 mm
(8 inch) circle