Brochure_PowerSelective_V1_18 - 第3页

Ensures Defined T emperature Profiles: The Preheat Area The preheat area of the PowerSelective also presents itself very flexible. Depending on your production requirements several quartz heater cassettes or convection p…

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High mix - high volume.
Modular system which ideally fits into each produc-
tion concept: for inline or stand-alone operation and
flexible lean production concepts.
Upgradable any time to minimize cycle times or to
increase the production volume.
Wide field of application: for multiwave soldering,
miniwave or even for conventional wave soldering.
Multiple soldering units and additional processes
may be integrated into one machine.
Wetted or non-wetted solder nozzles can be used as
well as innovative multi-nozzle tools.
High precision portal axis system which provides
maximum flexibility.
The rotating and tilting function of the gripper allows
ideal peel-off to minimize solder bridges.
Solder waves with touchless wave height control and
controlled nitrogen inertion, for best possible
soldering results and highest reliability.
Maximum machine availability due to quick change
nozzles and product change-over or maintenance
„on-the-fly“.
User-friendly operating interface and easy-to-handle
teaching function, online or offline.
100 % automatic process control with integrated AOI
system, flux quantity monitoring and many more
innovative functions.
Minimum maintenance requirements and ideal
accessibility.
For board or carrier dimensions up to 500 x 500 mm
[19.68" x 19.68"].
For the Flexible Production with High Throughput
SEHO PowerSelective is featured with an outstanding
modular machine construction that ensures highest flexibility.
The basic system can ideally be configurated to meet different
specific production requirements and provides the possibility
to be upgraded step by step at any later date to suit sub-
sequent production developments.
The PowerSelective may be equipped with several soldering
units. Thus, miniwave soldering processes and multiwave
soldering processes, even conventional wave soldering, can
be covered with only one machine.
Flexibility is also given in the handling of the assemblies.
Both, bare boards as well as assemblies in carriers can be
processed with the PowerSelective.
All selective soldering systems from SEHO feature a compre-
hensive hardware and software package to automatically
monitor and control the entire process 100 %.
Highest flexibility at high production volumes, maximum
soldering quality and process reliability sum up to one
result: SEHO PowerSelective.
Made in Germany:
Precision in Manufacturing = Quality Results
The highly precise portal axis system with a repeatability of
± 0.1 mm ensures the accurate and reliable positioning of the
assemblies at the different work stations.
The gripper system is mounted at the z axis. After the fluxing
and preheating process, the gripper takes the assembly from
the conveyor system, positiones it precisely at the soldering
units and finally deposits the printed circuit board back onto
the transport system. Depending upon requirement, there are
different grippers available which can be used for handling of
carriers, or direct gripper systems that are designed for the
handling of bare boards. If needed the grippers may be
equipped with additional functions, such as fixation of com-
ponents
The gripper is provided with a rotating function up to 270° and
may be tilted up to 12° to obtain an ideal solder angle even
when processing demanding assemblies.
Precise to the Point:
The Fluxer Area
The PowerSelective is equipped with a micro drop
jet fluxer unit which may either be integrated in the
inlet conveyor of the machine or in a separate fluxer
module in front of the PowerSelective, depending
on your requirements. This ensures lowest cycle
times. The micro drop jet fluxer targets the flux to
the exact point and avoids wetting of surrounding
areas.
Several nozzle heads may be installed. Each
nozzle head thereby can be equipped with up to
three micro drop jet nozzles to further reduce cycle
times.
The function of the fluxer nozzle can be monitored
by means of a capacitive sensor.
Maximum process reliability without any influence
on the cycle time is given with the flux quantity
monitoring system, winner of the NPI award. This
unique high precision fluxer control system
monitors the flux quantity that actually leaves the
nozzle during the fluxing process. Any deviation
from the pre-set value is immediately detected.
Maximum Flexibility in Your Production
P O W E R S E L E C T I V E
P O W E R S E L E C T I V E
Ensures Defined Temperature Profiles: The Preheat Area
The preheat area of the PowerSelective also presents itself
very flexible.
Depending on your production requirements several quartz
heater cassettes or convection preheat units may be installed
either at the inlet conveyor of the PowerSelective or in exter-
nal preheater modules. For printed circuit boards requiring
high heat energy, top side heatings are available as well.
Individually programmable quartz heater elements and board
surface temperature control by pyrometer ensure a precise,
gradient-controlled preheat process.
High Precision - Maximum Quality: The Soldering Area
The state-of-the-art solder nozzle technology developed by
SEHO ensures maximum precision in the soldering area.
Depending on your manufacturing requirements, up to two
soldering units may be integrated into the PowerSelective,
which are designed for miniwave soldering processes, multi-
wave soldering or even conventional wave soldering.
For electronic manufacturings with high volume and low mix
production, product-specific multi-nozzle tools ensure short
cycle times as all joints are soldered simultaneously.
The SEHO solder nozzle design guarantees optimum energy
transfer. Thus, perfect hole fill is achieved, even when pro-
cessing high mass assemblies and demanding board layouts.
Due to the special nozzle tool design, formation of solder
bridges and solder balls is reduced remarkably.
For productions with a wide range of assemblies, miniwave
solder nozzles guarantee highest flexibility.
Alternatively, there are two different solder nozzle types avail-
able. Non-wetted solder nozzles are nearly maintenance-free
and they are featured with an
almost unlimited lifetime. Wetted
solder nozzles stand out due to
the possibility that even ex-
tremely small pitches can be
processed without any difficul-
ties.
Of course, both the product-specific multi-nozzle tools as well
as the various miniwave solder nozzles are quickly ex-
changeable.
Change of nozzles or maintenance works can be made „on-
the-fly“ thus reducing production downtimes to zero.
Permanent touchless wave height control systems and
monitoring systems for automatic tool measurement guaran-
tee precise and consistent process conditions, without having
any influence on the cycle time.
Innovative: Integrated Additional Processes
The PowerSelective provides plenty of room for your indivi-
dual production requirements on smallest footprint.
This also includes integrated additional processes such as a
cooling area. In addition, a selective brush system can be
integrated to remove any flux and solder residues, or solder
balls immediately after the soldering process.
Moreover, the PowerSelective allows integration of the SEHO
PowerVision AOI system to detect potential soldering defects
automatically, such as insufficient wetting, missing pins or
solder bridges.
The benefits are quite obvious: absolutely safe processes
and reduction of your manufacturing costs.
innovative solder nozzle technology
maximum functionality on smallest footprint: soldering, brushing, AOI
Soldering is our Passion
P O W E R S E L E C T I V E
P O W E R S E L E C T I V E
Subject to technical modifications.
© by SEHO, D-97892 Kreuzwertheim • Printed in Germany 03 18 43 e
Headquarters Germany
SEHO Systems GmbH
Frankenstrasse 7 - 11
97892 Kreuzwertheim
Germany
Phone +49 (0) 93 42-889-0
Fax +49 (0) 93 42-889-200
E-Mail info@seho.de
Website www.seho.de
Americas
SEHO North America, Inc.
1445 Jamike Avenue Suite # 1
Erlanger, KY 41018
USA
Phone +1-859-371-7346
Fax +1-859-282-6718
E-Mail sehona@sehona.com
Website www.sehona.com
automatic brush system
integrated in the process area
Technical Data and Options
Unique: 100 % Process Control
The PowerSelective provides state-of-the-art control
technology, with sensors and software tools that continuously
monitor all process steps:
From automatic tool measurement and position correction
with fiducial recognition, to flux quantity monitoring and
reproducible temperature profiles in the preheat area as well
as the permanent and touchless wave height control.
Moreover, the comprehensive package includes an
automatic solder level control, a nozzle coding system with
intelligent tool management as well as process visualization
and solder joint inspection with an integrated AOI system.
With the machine communication software mcServer,
selective soldering processes are made transparent and can
be traced completely. The mcServer software tool collects,
analyzes and archieves all information about the machine and
production process systematically.
Teaching of solder joints is particularly easy with the
PowerSelective, and of course can be made offline in case of a
wide range of assemblies. Basic data are taken from a picture of
the printed circuit board, gerber data or DXF files. The wizard
comfortably takes the user step by step through the software.
Likewise uncomplicated is the programming process for an
integrated AOI system: The inspection areas are already pre-
defined from the soldering program and a comprehensive
component library with standard values that can be adapted any
time, simplifies programming of the AOI tremendously.