DECAN_S1_Administrator′s_Guide(Eng_Ver1.5)_Print.pdf - 第24页
Next Generation, Multi-Functional Plac er DECAN S1 Administrator’s Guide x Users of artificial cardiac p ac emakers must not approach the machine If a failure occurs to an artificial cardiac pacemaker due to the magn eti…
Preface
ix
Internal Part of the Machine.
The following labels are attached on the rear part of this machine.
Figurei.3 Safety labels attached to the inside of the machine at the front
Do not touch the head assembly.
Be careful of electric shock.
Turn off the main switch before performing
maintenance since fatal personnel injury
may occur. Be careful of the residual
current.
Next Generation, Multi-Functional Placer DECAN S1 Administrator’s Guide
x
Users of artificial cardiac pacemakers
must not approach the machine
If a failure occurs to an artificial cardiac
pacemaker due to the magnetic force of
linear motor inside the cover, the user may
be injured or die. Therefore, do not
approach the machine.
Danger of injury due to magnetic force.
If a metallic material or ornament sticks to
the machine due to the magnetic force of
linear motor inside the cover, a person may
be injured. Therefore, exercise caution.
Do not attach a magnet to the linear
scale.
Keep the linear scale clean by preventing
it from being contaminated by foreign
materials.
Preface
xi
Specifications of Machine
Applicable component sizes
Vision recognition system
The sizes of components applicable to this machine are prescribed in the following table,
and is applicable to general components usage as well.
Tablei.1Configuration of the Head and Vision Recognition System
Flying vision
MEGA FOV
22.4 mm
Chip 03015 ~□16 mm
Standard
IC,
Connector
Less than □16 mm
Lead Pitch: Greater than 0.4 mm
Standard
BGA, CSP
Less than □16 mm, Ball Dia.: Greater
than 0.2 mm, Ball Pitch: Greater than
0.4 mm
Less than □8 mm, Ball Dia.: Greater
than 0.18 mm, Ball Pitch: Greater than
0.36 mm
Standard
Upward
vision MEGA
FOV 35 mm
IC,
Connector
Less than □16 mm, Lead Pitch: Greater
than 0.3 mm
Less than □32 mm, Lead Pitch: Greater
than 0.4 mm
Option
BGA, CSP
Less than □16 mm, Ball Dia.: Greater
than 0.2 mm, Ball Pitch: Greater than
0.4 mm
Less than □32 mm, Ball Dia.: Greater
than 0.25 mm, Ball Pitch: Greater than
0.5 mm
Option