DECAN_S1_Administrator′s_Guide(Eng_Ver1.5)_Print.pdf - 第25页
Preface xi Specifications of Machine Applicable component sizes Vision recognition system The sizes of components applicable to this m achine are prescribed in the following table, and is applicable to general components…
Next Generation, Multi-Functional Placer DECAN S1 Administrator’s Guide
x
Users of artificial cardiac pacemakers
must not approach the machine
If a failure occurs to an artificial cardiac
pacemaker due to the magnetic force of
linear motor inside the cover, the user may
be injured or die. Therefore, do not
approach the machine.
Danger of injury due to magnetic force.
If a metallic material or ornament sticks to
the machine due to the magnetic force of
linear motor inside the cover, a person may
be injured. Therefore, exercise caution.
Do not attach a magnet to the linear
scale.
Keep the linear scale clean by preventing
it from being contaminated by foreign
materials.
Preface
xi
Specifications of Machine
Applicable component sizes
Vision recognition system
The sizes of components applicable to this machine are prescribed in the following table,
and is applicable to general components usage as well.
Tablei.1Configuration of the Head and Vision Recognition System
Flying vision
MEGA FOV
22.4 mm
Chip 03015 ~□16 mm
Standard
IC,
Connector
Less than □16 mm
Lead Pitch: Greater than 0.4 mm
Standard
BGA, CSP
Less than □16 mm, Ball Dia.: Greater
than 0.2 mm, Ball Pitch: Greater than
0.4 mm
Less than □8 mm, Ball Dia.: Greater
than 0.18 mm, Ball Pitch: Greater than
0.36 mm
Standard
Upward
vision MEGA
FOV 35 mm
IC,
Connector
Less than □16 mm, Lead Pitch: Greater
than 0.3 mm
Less than □32 mm, Lead Pitch: Greater
than 0.4 mm
Option
BGA, CSP
Less than □16 mm, Ball Dia.: Greater
than 0.2 mm, Ball Pitch: Greater than
0.4 mm
Less than □32 mm, Ball Dia.: Greater
than 0.25 mm, Ball Pitch: Greater than
0.5 mm
Option
Next Generation, Multi-Functional Placer DECAN S1 Administrator’s Guide
xii
The placement Speed
The following data concerns the speed of placement for each part. The actual cycle time
can vary depending on the size of PCB, frequency of the nozzle replacement, etc.
The pick and place cycle time
Tablei.2The pick and place speed
Memo In actual placement, the conditions that determine the cycle time may
vary depending on many factors such as the type of components, size
of PCB, placement position, etc. For more detailed information,
please contact our business department or the local agent.
Upward
vision MEGA
FOV 45 mm
IC,
Connector
Less than □32 mm, Lead Pitch: Greater
than 0.4 mm
Less than □42 mm, Lead Pitch: Greater
than 0.5 mm
Standard
BGA, CSP
Less than □16 mm, Ball Dia.: Greater
than 0.2 mm, Ball Pitch: Greater than
0.4 mm
Less than □32 mm, Ball Dia.: Greater
than 0.25 mm, Ball Pitch: Greater than
0.5 mm
Less than □42 mm, Ball Dia.: Greater
than 0.4 mm, Ball Pitch: Greater than
1.0 mm
Standard
Maximum
Height
Flying vision 10 mm Standard
Upward
vision
Less than □42 mm: 15 mm
Over than □42 mm: 6 mm
Option
Classifi
cation
Speed Remarks
Chip
47,000 CPH (1608)
Simultaneous Pickup Standard Fly Vision