DECAN_S1_Administrator′s_Guide(Eng_Ver1.5)_Print.pdf - 第26页
Next Generation, Multi-Functional Plac er DECAN S1 Administrator’s Guide xii The placement Speed The following data concerns th e speed of placement for each part. The actual cycle time can vary depending on the size of …
Preface
xi
Specifications of Machine
Applicable component sizes
Vision recognition system
The sizes of components applicable to this machine are prescribed in the following table,
and is applicable to general components usage as well.
Tablei.1Configuration of the Head and Vision Recognition System
Flying vision
MEGA FOV
22.4 mm
Chip 03015 ~□16 mm
Standard
IC,
Connector
Less than □16 mm
Lead Pitch: Greater than 0.4 mm
Standard
BGA, CSP
Less than □16 mm, Ball Dia.: Greater
than 0.2 mm, Ball Pitch: Greater than
0.4 mm
Less than □8 mm, Ball Dia.: Greater
than 0.18 mm, Ball Pitch: Greater than
0.36 mm
Standard
Upward
vision MEGA
FOV 35 mm
IC,
Connector
Less than □16 mm, Lead Pitch: Greater
than 0.3 mm
Less than □32 mm, Lead Pitch: Greater
than 0.4 mm
Option
BGA, CSP
Less than □16 mm, Ball Dia.: Greater
than 0.2 mm, Ball Pitch: Greater than
0.4 mm
Less than □32 mm, Ball Dia.: Greater
than 0.25 mm, Ball Pitch: Greater than
0.5 mm
Option
Next Generation, Multi-Functional Placer DECAN S1 Administrator’s Guide
xii
The placement Speed
The following data concerns the speed of placement for each part. The actual cycle time
can vary depending on the size of PCB, frequency of the nozzle replacement, etc.
The pick and place cycle time
Tablei.2The pick and place speed
Memo In actual placement, the conditions that determine the cycle time may
vary depending on many factors such as the type of components, size
of PCB, placement position, etc. For more detailed information,
please contact our business department or the local agent.
Upward
vision MEGA
FOV 45 mm
IC,
Connector
Less than □32 mm, Lead Pitch: Greater
than 0.4 mm
Less than □42 mm, Lead Pitch: Greater
than 0.5 mm
Standard
BGA, CSP
Less than □16 mm, Ball Dia.: Greater
than 0.2 mm, Ball Pitch: Greater than
0.4 mm
Less than □32 mm, Ball Dia.: Greater
than 0.25 mm, Ball Pitch: Greater than
0.5 mm
Less than □42 mm, Ball Dia.: Greater
than 0.4 mm, Ball Pitch: Greater than
1.0 mm
Standard
Maximum
Height
Flying vision 10 mm Standard
Upward
vision
Less than □42 mm: 15 mm
Over than □42 mm: 6 mm
Option
Classifi
cation
Speed Remarks
Chip
47,000 CPH (1608)
Simultaneous Pickup Standard Fly Vision
Preface
xiii
Size and mass of the machine
Height (Under the condition that the height of the PCB upper surface is 900 mm)
1: Up to the upper surface of signal light (1,995 mm)
2: Length (1,430 mm)
3: Width (1,740 mm Including front / rear cover)
4: Up to the upper surface of cover (1,485mm)
Mass (The mass which does not include the Docking Cart and Feeder.)
Type Mass (kg) Height of Conveyor
DECAN S1
(Standard)
1,600 900mm
1,660
950mm
DECAN S1
(Docking Option)
1,570 900mm
1,630
950mm