N7201A653E - 第409页

NPM- TT2 EJ M1EE-MB-13M-0 2 ACTIVATION 13-15-2 -4 Calibration Checking and reflection of placement (placement) 3 2 1 (First layer) (Second layer) 4 8 7 Do not press the STOP button while accura cy verificat ion is carrie…

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NPM-TT2 EJM1EE-MB-13M-02
3
13-15-2-3
Detailed process 2
Accuracy
verifica-
tion
Maintenance
13-15-2
Prepare the glass PCB
Production preparation 3 (preparation for verification material )
Prepare a glass PCB set (N610108752AA) for placement accuracy check.
(Glass PCB, background plate and mirror are included)
Part Background
JIG_BGA Black sponge
(Set the background plate)
1005JIG chip: ERJJ02AAAAAV,
0402R, etc.
Insert a mirror between the glass and the
background plate.
(See the manual included in the glass PCB set)
Affix the tape to the area where components are placed (Inside the dotted line in the picture
below is a rough area)
Keep away from recognition marks on the both edges of the glass.
Affix the tape with no air bubbles.
Prepare the background based on a component to verify its accuracy.
Affix the double-faced tape onto the glass PCB.
Glass PCB after 1005JIG chip are placed
Glass PCB after JIG_BGA are placed
MirrorPlacement
area
JIG_BGAPlacement
area
Background plate
(black sponge)
1005JIG
chip
NPM-TT2 EJM1EE-MB-13M-02
ACTIVATION
13-15-2-4
Calibration
Checking and reflection of placement (placement)
321
(First layer)
(Second layer)
4
8
7
Do not press the STOP button
while accuracy verification is
carried out.
You cannot restart operation in
the middle of accuracy
verification.
NOTICE
6
Load glass PCB
Production starts as the
glass PCB is loaded
upon completion of
production preparation.
If the machine is coupled to
another machine, adjust the PCB
width of the adjacent machine to
216 mm, and load the PCB into
the upstream machine.
NOTICE
Confirm the
message
5
The head camera screen
appears and you can view
the part being measured.
To use accuracy verification
MCDATA:
(→ P.13-15-1
-1 Reflection
of verification data’)
ACTIVATION
NPM-TT2 EJM1EE-MB-13M-02
1
Accuracy
verifica-
tion
2
(Automatic run ends)
+
13-15-2-5
Detailed process 3
Chip component 0.040 mm
Odd form component 0.030 mm
3
4
5
Switch it with
When you do not end
Maintenance
13-15-2
Checking and reflection of placement (checking placement results)
2
3
4
5
Upon completion of placement,