ASMPT Brochure SIPLACE SX_EN_230321_interaktiv - 第3页
Scalable Unique interchangeable gantries allow you to shift placement capacity to where it’s needed T otal exibility T apes, sticks, bowls, trays and many more feeder options in addition to exible multi-track conveyors…
EVEN THE BEST WAS NO LONGER
GOOD ENOUGH FOR US
What happens when the most demanding electronics manufacturers get
together with the most innovative developers? They go to work to make
the best placement solution on the market even better. The new genera-
tion of the SIPLACE SX placement platform is now faster, more accurate
and more exible. It is also smart, open, learns quickly, adapts to any
challenge, and makes your employees’ lives easier.
With options such as Smart Pin Support, the OSC Package, the Clinching
Tool and the exchange of complete feeder tables with AMR solutions, to
name just a few, it also ts perfectly into ASMPT’s modular, exible and
manufacturer-independent Open Automation concept.
Get to know the new SIPLACE SX and learn what’s possible in today’s
high-mix production environments – and no other machine can deliver.
THE NEW GENERATION
SIPLACE SX
Placement Head CP20
▪ Expanded component spectrum: 0201
metric to 8.2 mm × 8.2 mm × 4 mm
▪ More placement precision:
±34 µm @ 3 sigma
▪ Extremely fast: Up to 43,250 cph
▪ Maximum reliability: New component
camera with GigE interface for better
images with higher resolution
Placement Head CPP
▪ Switches from pick-and-place to
collect-and-place to mixed mode
▪ Component height: Up to 15.5 mm
▪ Component weight: Up to 20 g
▪ Automatic pin 1 detection
▪ LED Centering
Placement Head TWIN
▪ Component height: Up to 50 mm
▪ Component weight: Up to 300 g
▪ Snap-in detection
▪ Improved THT placement
THE HEAD MAKES
THE DIFFERENCE
THREE INNOVATIVE PLACEMENT HEADS DELIVER
PERFORMANCE, FLEXIBILITY AND BALANCE.
Modular, exible, open – attributes that perfectly
describe our SIPLACE SX. Standard interfaces
and a growing number of automation options
make it the number one choice for your
Integrated Smart Factory.
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Scalable
Unique interchangeable gantries allow you to shift
placement capacity to where it’s needed
Total exibility
Tapes, sticks, bowls, trays and many more feeder
options in addition to exible multi-track conveyors
and PCB sizes of up to 1,525 mm by 560 mm
Fast
Up to 86,500 cph
Smart
Intelligent self-healing, self-learning and
self-verication functions reduce operator
assists to a new minimum
OSC Package
For very odd-shaped, large and/or heavy
components and full THT capabilities
Ready for predictive maintenance
Sensors monitor the machine’s behavior
Powerful software
Our superior programming, station
software and workow solutions ensure
top performance and easy operation
THE SIPLACE SX
PUTS YOU ON THE FAST TRACK
More about the
SIPLACE SX
Placement Head TWIN
▪ Component height: Up to 50 mm
▪ Component weight: Up to 300 g
▪ Snap-in detection
▪ Improved THT placement
WORKS – SMART SHOPFLOOR MANAGEMENT SUITE
With the Smart Shop Floor Management Suite WORKS, you get the most out of your
SIPLACE SX production line and lay the foundation for your Integrated Smart Factory.
It makes your employees’ work easier in their respective areas, controls and optimizes
the production ow, and calculates the component requirements during the assembly
process. AMR eet management applications and enterprise solutions such as MES
and ERP software can be easily connected.
Open and standard-based interfaces such as IPC-HERMES-9852 and IPC-CFX
ensure consistent M2M and M2H communication.
SMART
WORKFLOWS
PLANNING
OPTIMIZATION
PROGRAMMING
LOGISTICS
MONITORING
PREPARATION
INTEGRATION
OPERATIONS
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SIPLACE SX
UNBEATABLE FLEXIBILITY
THE SIPLACE SX ADAPTS TO YOUR NEEDS
The SIPLACE SX is the world’s leading placement platform for high-mix electronics
production. Its exibility begins with its huge component spectrum that is covered by three
improved placement heads: CP20, CPP, and TWIN. It also oers many feeder and con-
veyor options. Even odd-shaped components can be supplied with exceptional reliability.
Smaller boards with sizes of up to 450 mm by 260 mm can be moved with the ecient
dual conveyor, and with the optional Smart Transport Module you can process boards that
are up to 1,525 mm by 560 mm large.
OSC Package
Where others give up, the SIPLACE SX pushes the envelope with its OSC Package.
The enhanced component diversity minimizes manual labor, and the machine’s integrated
process controls maximize your yield.
Third-Party Feeder
Open interfaces permit the use of a wide range of feeders – also from third-party
suppliers.
3D images
The SIPLACE SX generates 3D images by combining two oset images taken by the
high-resolution component camera. In this way, even damaged THT pins can be reliably
detected. It also performs targeted on-board checks of highly critical areas for correct
solder pads, missing components under shields, and correct positioning.
Snap-in detection
During the assembly process, the SIPLACE SX continuously checks the vertical position
of components to ensure their correct placement.
Placement force
The SIPLACE SX features total placement force control from touchless
placement and 0.5 N to 100 N, from the placement of sensitive LEDs to
that of robust connectors.
Acceleration
No unnecessary slow-downs: The SIPLACE SX
further improves your productivity by automatically
determining the best travel speeds for OSCs.
Equipment Level
Shop Floor Level
Factory Level
Multi Factory Level
Cloud Services
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