A10011-ASM-T45-EN-Spec-E_DMS - 第11页

11 Placement Heads SIPLACE CP6 SIPLACE CP6 with component camera, type 3 0 GigE Range of co mponents a a) Please note tha t the component range that can be pla ced is al so affected by the pad geometry, the custom - er-s…

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Placement Heads
SIPLACE CP12
SIPLACE CP12
with component camera type 30 GigE
Range of components
a
a) Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific
standards and the packaging tolerances.
01005 to flip-chip, bare die, PLCC44, BGA, µBGA, TSOP, QFP, SO to
SO32, DRAM
Component specification
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
b
Max. weight
b) For high volume 01005-placement it is recommended to equip the CP12 with its optional 01005-package that con-
tains special nozzles and low force segments.
8.5 mm
c
0.3 mm
0.15 mm
0.25 mm
0.14 mm
0.4 mm x 0.2 mm
18.7 mm x 18.7 mm
2 g
c) 8.5 mm on Flex machines, 7.5 mm on Speed machines.
Nozzle types 30xx
X/Y accuracy
d
d) The accuracy value was measured using the vendor-neutral IPC standard.
± 41 μm/3σ
Angular accuracy ± 0.5°/3σ
Component range 98.5%
Illumination levels 5
Possible illumination level
setting
256
11
Placement Heads
SIPLACE CP6
SIPLACE CP6
with component camera, type 30 GigE
Range of components
a
a) Please note that the component range that can be placed is also affected by the pad geometry, the custom-
er-specific standards and the packaging tolerances.
0201 to 27 x 27 mm²
Component specification
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
8.5 mm
b
0.3 mm
0.15 mm
0.25 mm for components< 18 mm x 18 mm
0.35 mm for components 18 mm x 18 mm
0.14 mm for components < 18 mm x 18 mm
0.2 mm for components 18 mm x 18 mm
0.6 mm x 0.3 mm
27 mm x 27 mm
5 g
b) 8.5 mm on Flex machines. No Speed machine configuration
Nozzle types 38xx, 39xx
X/Y accuracy
c
c) The accuracy value was measured using the vendor-neutral IPC standard
± 52.5 μm/3σ
Angular accuracy ± 0.225°/3σ
Illumination levels 5
Possible illumination level setting 256
12
Placement Heads
SIPLACE TH
SIPLACE TH
with stationary
camera type 36 GigE
(Standard)
with stationary
camera type 33 GigE
(Fine pitch)
with stationary
camera type 25 GigE
(Flip chip)
Component range
a
a) Please note that the placeable component range is also affected by the pad geometry, the customer-specific standards, the
component packaging tolerances and the component tolerances.
0603 to SO, PLCC, QFP,
BGA, special components,
bare dies, flip-chips
0402 to SO, PLCC, QFP, BGA,
special components, bare dies,
flip-chips
0201 to SO, PLCC, QFP,
sockets, plugs, BGA, spe-
cial components, bare dies,
flip-chips, shields
Component specs
Max. height
Min. lead pitch
Min. lead width
Min. ball pitch
Min. ball diameter
Min. dimensions
Max. dimensions
Max. weight
b
b) If standard nozzles are used
25 mm
0.4 mm
0.24 mm
0.56 mm
0.32 mm
1.6 mm x 0.8 mm
32 mm x 32 mm
(single measurement)
For use with two nozzles:
50 mm x 50 mm or 69 mm x
10 mm
For use with one nozzle
(multiple measurement):
78 mm x 78 mm or
110 mm x 10 mm
up to 200 mm x 110 mm
(with restrictions)
100 g
25 mm
0.3 mm
0.15 mm
0.35 mm
0.2 mm
1.0 mm x 0.5 mm
55 mm x 45 mm
(single measurement)
For use with two nozzles:
50 mm x 50 mm or 69 mm x
10 mm
For use with one nozzle (multi-
ple measurement):
78 mm x 78 mm or
110 mm x 10 mm
up to 200 mm x 110 mm (with
restrictions)
100 g
25 mm
0.25 mm
0.1 mm
0.14 mm
0.08 mm
0.6 mm x 0.3 mm
16 mm x 16 mm
(single measurement)
55 mm x 55 mm
(multiple measurement)
100 g
Programmable set-
down force
1.0 N - 15 N 1.0 N - 15 N 1.0 N - 15 N
Nozzle types
c
c) Over 300 different nozzles and 100 gripper types are available, with an extensive nozzle database available online.
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
5xx (standard)
4xx + adapter
8xx + adapter
9xx + adapter
Nozzle spacing for
P&P heads
70.8 mm 70.8 mm 70.8 mm
X/Y accuracy
d
d) The SIPLACE accuracy value is measured during the machine acceptance tests. It corresponds to the conditions set out in the
SIPLACE scope of service and supply.
± 50 µm/3σ ± 50 µm / 3σ ± 22 µm / 3σ
Angular accuracy ± 0.05°/3σ ± 0.05° / 3σ ± 0.05° / 3σ
Illumination level 6 6 6
Possible illumination
level settings
256 256 256