A10011-ASM-T45-EN-Spec-E_DMS - 第9页

9 Placement Heads SIPLACE CP14 SIPLACE CP14 with compone nt camera type 23 GigE Component range a a) Please note that the placeable component r ange is also affected by the pad geometr y, the custo mer-spe - cific standa…

E by SIPLACE Placement Heads

Overview

Collect&Place principle

The SIPLACE CP14/12/6

operates according to the

Collect&Place principle i.e.

one cycle includes pickup or

"collection" of 14/12/6 com-

ponents, their optical center-

ing on the board and their

rotation into the required

placement angle and posi-

tion. They are then placed

gently and accurately onto

the PCB. This principle is

particularly suitable for high-

speed placement of standard

components.

Pick&Place principle

The high-precision SIPLACE

TwinHead or P&P module

functions according to the

Pick&Place principle. One or

two components are picked

up by the SIPLACE Twin-

Head/PP, optically centered

on the way to the placement

position and then rotated into

the required placement

angle. This principle is ideally

suitable for fast and precise

placement of special compo-

nents in the fine pitch or

super fine pitch field, plus

complex and heavy compo-

nents which may need grip-

pers.

Control and self-learning

functions

The reliability of the

SIPLACE placement heads

can be enhanced even fur-

ther with various checking

and self-learning functions.

• Component sensor

Checks the presence of

the components on the

nozzle before the pickup

and placement process

• Digital camera

Checks the position of

each component on the

nozzle. This check is per-

formed in a single step,

with no extra time involved

but with optimum scan-

ning of each individual

component.

• Force sensor

Monitors the prescribed

component set-down

force.

The sensor stop proce-

dure enables compensa-

tion of height differences

during pickup and PCB

warpage during place-

ment.

• Vacuum sensor

Checks whether the com-

ponent was correctly

picked up or placed.

Camera Configurations

Head 1 Camera Optional Head 2 Standard Camera Optional

a) Flip-Chip Camera, Type 25 GigE as additional stationary camera is possible

CP14 Type 23 GigE -- -- -- --

CP12 Type 30 GigE -- -- -- --

CP12 Type 30 GigE -- PP Type 36 GigE Type 33 GigE

Type 25 GigE

CP6 Type 30 GigE -- PP Type 36 GigE Type 33 GigE

Type 25 GigE

-- -- -- TH Type 36 GigE Type 33 GigE

Type 25 GigE

Placement Heads

SIPLACE CP14

with component camera type

23 GigE

Component range

a) Please note that the placeable component range is also affected by the pad geometry, the customer-spe-

cific standards, the component packaging tolerances and the component tolerances.

01005 to 2220, Melf, SOT,

SOD

Component spec.

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

4 mm

0.25 mm

0.1 mm

0.4 mm

0.2 mm

0.4 mm x 0.2 mm

6 mm x 6 mm

1.0 g

Programmable set-down

force

1.3 - 4.5 N

Nozzle types 4xxx

X/Y accuracy

b) The SIPLACE accuracy value is measured during the machine acceptance tests. It corresponds to the

conditions set out in the SIPLACE scope of service and supply.

± 41 µm/3σ

Angular accuracy ± 0.5° / 3σ

Illumination level 5

Possible illumination

level settings

256

Placement Heads

SIPLACE CP12

with component camera type 30 GigE

Range of components

a) Please note that the component range that can be placed is also affected by the pad geometry, the customer-specific

standards and the packaging tolerances.

01005 to flip-chip, bare die, PLCC44, BGA, µBGA, TSOP, QFP, SO to

SO32, DRAM

Component specification

Max. height

Min. lead pitch

Min. lead width

Min. ball pitch

Min. ball diameter

Min. dimensions

Max. dimensions

Max. weight

b) For high volume 01005-placement it is recommended to equip the CP12 with its optional 01005-package that con-

tains special nozzles and low force segments.

8.5 mm

0.3 mm

0.15 mm

0.25 mm

0.14 mm

0.4 mm x 0.2 mm

18.7 mm x 18.7 mm

2 g

c) 8.5 mm on Flex machines, 7.5 mm on Speed machines.

Nozzle types 30xx

X/Y accuracy

d) The accuracy value was measured using the vendor-neutral IPC standard.

± 41 μm/3σ

Angular accuracy ± 0.5°/3σ

Component range 98.5%

Illumination levels 5

Possible illumination level

setting

256