WaferTransportSolutionManual - 第84页

INSTALLATION EQUIPMENT INSTALLATION 3.8 Wafer Transport Solution Chapter Issue 1 Aug 11 CHAD Work Mate Range Refer to W afermate 300-2. 1 T ransfer S tation; Drawing No. 520 588. NOTE If a 125 to 200mm con veyor system i…

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INSTALLATION
EQUIPMENT INSTALLATION
Chapter Issue 1 Aug 11 Wafer Transport Solution 3.7
EQUIPMENT INSTALLATION
CHAD and NUTEK Equipment
Reference should be made to the technical and installation data provided by
the wafer handling equipment manufacturers. This manual gives a brief
overview of the specific equipment proposed by DEK for this application.
Information provided in this manual is for guidance only. DEK suggests that
users familiarise themselves with the specific instructions on safety,
installation, maintenance and operation of any equipment placed in-line with
the DEK printer(s).
The section below describes the services required to interface the wafer
handling equipment to the DEK printer.
Services In order for the conveyor to function correctly the following services must be
available:
• Electrical Supply
• Pneumatic Supply
• Upline/Downline Machine Interface (FMI)
The services required for both equipment types are shown below:
NUTEK Refer to linking conveyor manual: NTM410L-1000-1(S)
Electrical The mains input, to the linking conveyor, is fed directly from a separate factory
mains wall outlet.
The conveyor operates on 230VAC/50Hz single phase ac mains or 110VAC/
60Hz single phase ac mains.
Pneumatic The conveyor requires a pneumatic supply of clean, non lubricated air which
should maintain a minimum pressure 5 Bar and a maximum of 8 Bar.
The air should be to ISO 8573.1 standard, quality class 2.3.3, where:
• 2 dirt = 1 micron
• 3 water = -20°C pressure dewpoint
• 3 oil = 1mg/m3
The air supply, from the optional services panel at the rear of the host printer,
is fed to the input connector of the linking conveyor where it is directly
connected to the regulator. The regulator is set to 5 Bar.
Interface The conveyor interface (FMI) is via standard SMEMA protocol. The FMI pod
on the host printer connects via M28SK02 to a pair of connectors PLA/PLB of
the respective upstream and downstream connectors.
INSTALLATION
EQUIPMENT INSTALLATION
3.8 Wafer Transport Solution Chapter Issue 1 Aug 11
CHAD Work Mate
Range
Refer to Wafermate 300-2. 1 Transfer Station; Drawing No. 520588.
NOTE
If a 125 to 200mm conveyor system is used refer to the Wafermate 300-3 data
sheet.
Electrical The mains input, to the WM 300-2, is fed directly from a separate factory
mains wall outlet.
The WM 300-2 operates on 200 to 240VAC/50Hz, 20amps, single phase ac
mains.
Pneumatic The WM 300-2 requires a pneumatic supply of clean, non lubricated air which
should maintain a minimum pressure 5 Bar and a maximum of 8 Bar.
The air should be to ISO 8573.1 standard, quality class 2.3.3, where:
• 2 dirt = 1 micron
• 3 water = -20°C pressure dewpoint
• 3 oil = 1mg/m3
The air supply, from the optional services panel at the rear of the host printer,
is fed to the input connector of the WM 300-2 where it is directly connected to
the regulator. The regulator is set to 6 Bar.
Interface The WM 300-2 interface (FMI) is via standard SMEMA protocol. The FMI pod
on the host printer connects via M28SK02 to a pair of connectors PLA/PLB of
the respective upstream and downstream connectors.
INSTALLATION
EQUIPMENT INSTALLATION
Chapter Issue 1 Aug 11 Wafer Transport Solution 3.9
CHAD Handler Overview
WARNING
HEAVY OBJECT. EXTREME CAUTION SHOULD BE EXERCISED WHEN
MANUALLY HANDLING HEAVY ITEMS INTO OR OUT OF THE MACHINE.
WARNING
MOVING PARTS. MOVING PARTS ARE PRESENT IN THE VICINITY OF THIS
WARNING LABEL, THESE PARTS HAVE THE POTENTIAL TO CAUSE INJURY.
There are two CHAD Handlers:
• WaferMate 300-2 handling wafers from 200mm to 300mm diameter.
• WaferMate 200-3 handling wafers from 125mm to 200mm diameter.
Sequence Both systems provide a pair of front loading FOUP’s (Wafer Stacks). They
each have a four axis robotic arm which, dependent upon configuration,
provide wafer handling to one or two DEK printers.
1. Wafers loaded in the FOUP's are picked out of the stack by the robotic arm.
2. The arm places the wafer into the aligner which spins to detect the wafer
slot or notch position.
3. Once aligned, the wafers are loaded into pallets where they are fed into the
flux printer.
4. After printing, the pallet is fed back into the transfer station, through the
handler’s centre section and out to the opposite side transfer station, for
transfer to the ball placement printer.