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SIPLACE GEM for S25HM, S27HM, HS50 , HS60 SW Version GEM 503.02 HOST Inter fac e Manual Page 238 of 243 ©Siemens AG, all rights reser ved 10 Possible Uses of the SIPLA CE GEM Interface 10.1 Process Control You can use th…

SIPLACE GEM for S25HM, S27HM, HS50, HS60 SW Version GEM 503.02

HOST Interface Manual

9 Alarms

There are no alarms defined for SIPLACE

ALID ALCD ALTX Description ON CEID OFF

CEID

ALID Alarm ID

ALCD Alarm Severity Code. The low-order 7-bits of ALCD specifies the severity

code. The high-order bit (bit-8) shows the current alarm state (1=SET,

0=CLEAR).

ALTX Alarm Text. This is the actual string sent the Host in the Alarm Report

(S5F1).

ON CEID This is the Collection Event that is signaled when the alarm state changes

from CLEAR to SET ("going-on").

OFF CEID This is the Collection Event that is signaled when the alarm state changes

from SET

to CLEAR ("going-off").

SIPLACE GEM for S25HM, S27HM, HS50 , HS60 SW Version GEM 503.02

HOST Interface Manual

10 Possible Uses of the SIPLACE GEM Interface

10.1 Process Control

You can use the SIPLACE GEM interface to check and continuously improve your

production process. To do so, you must monitor critical process parameters. In the event

there are large deviations from the desired value, you can stop the process and make

corrections.

One

example: Pickup reliability

You can monitor the pickup reliability with the event

CEID 2010016 PickupError.

You will obtain vacuum values from the pickup processes from the Event PickUpxCycle.

You will receive summarizing information about pickup reliability relative to the placement

head and the PCB from the variables GANTRYINFOREVx. With the variables

SEGMENTINFOREVx you will obtain summarizing information relative to nozzles. This

will enable you to pinpoint, for example, inaccurately adjusted feeders or faulty nozzles.

10.2 Traceability

You can collect all data you require to retrace the use of components on the various

PCBs.

If you store these data, you can still ascertain later, e.g., if there are recall actions, which

PCBs were populated with components from a faulty batch.

You can use the component barcode to acquire the batches used. With a single GEM

event you can ascertain where which components were placed.

Please note that you must have traceability option installed an activated to get traceability

data.

10.2.1 Structure of traceability data

You can use the event CEID 2510001 TraceData with predefined report 46 to get all

traceability data of one PCB.

Variable VID 2512001 TRACE_PCB_DATA gives you basic information about the whole

board.

Variable VID 2512003 TRACE_SINGLE_CIRCUIT gives you information related to single

circuits. If you don't have single circuits you will have only one structure which means the

whole board.

Variable VID 2512002 TRACE_ALL_COMPONENTS gives you information about the

batches used to produce the actual board. This may be a tape or another kind of feeder.

In this version it is not possible to include information from a MTC into your traceability

data. All values beginning with MTC... are zero.

There is a reference number which gives you the relation of a single circuit to the tapes

which where used for the board.

SIPLACE GEM for S25HM, S27HM, HS50, HS60 SW Version GEM 503.02

HOST Interface Manual

The structure of the traceability data is the following:

In case of a splice you will find the components used before the splice and the

components behind your splice in your data.

Please read carefully the Traceability Manual of your traceability option to get information

about the reliability of traceability data. There you will also find information of how to get

component data, make setup control, handle with filling levels and handle splice detection.

10.2.2 Additional Events for Traceability

You can use CEID 2510002 SpliceDetected to control the splice sensors or to have

additional control over batch changes.

If the operator will activate or deaktivate traceability option you may receive the events

CEID 2510003 TraceOn or CEID 2510004 TraceOff. If Traceability is active you will

receive TraceOn event with every data preparation.

10.3 Determining the Productive Times

Several methods are available to monitor the productive times of SIPLACE. The definition

of the individual times, the downtime of a machine is very highly user-specific. For that

reason, several variants are presented here:

Running the machine up to speed

Beginning: MachineRestarted (CEID 2010015)

End: ToGUIRefRunReady (CEID 1120258)

TRACE

PCB

DAT

TRACE_SINGLE_CIRCUIT

SINGLE CIRCUIT 1

Ref1 - Ref2 - ...... - Refn

SINGLE CIRCUIT 2

Ref1 - Ref2 - ...... - Refn

SINGLE CIRCUIT 3

Ref1 - Ref2 - ...... - Refn

TRACE_ALL_COMPONENTS

Component 1 - Ref x

Component data

Component 2 - Ref y

Component data

Component n - Ref z

Component data