PI series 3D SPI-brochure - 第3页
4 5 P I s e ri e s 3D S P I P erfe c t s older jo ints made s im ple Measu re paste v o lume wit h extreme p recision. I mprov e your process and tolerance settin gs with a utomat ic pad grou ping . And mon itor your pro…
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Goodbye defects.
Hello solder paste perfection.
What are the most common defects in your SMT line? And what would you
save if you could catch them earlier in your process – or even eliminate them
from your design altogether?
If you’re like most manufacturers, the answers to these questions will likely
bring you back to the solder paste printing process. Because this is where more
than 61% of all SMT defects originate, according to our latest industry survey.
Whether the problem is solder shorts or insu cient solder paste deposits,
accurate solder paste inspection is often the most economical way to detect,
predict and prevent defects before they occur.
As solder paste deposits continue to decrease in size, the value of advanced
SPI analysis will only grow over time. This is precisely what makes the innovative
PI Series 3D SPI system an increasingly critical part of a complete metrology
solution. It allows you to measure paste volume with unmatched accuracy and
unprecedented simplicity. So that you can continually improve your process
and tolerance settings – and take advantage of the unambiguous real-time
information you need to take your yield to new heights.
It’s one more part of the Mycronic 4.0 intelligent factory,
and one step closer to perfection.
France-based Vi TECHNOLOGY, a global pioneer in 3D AOI and
SPI, is now part of the Mycronic Group. Already used by leading
global manufacturers of aerospace, automotive and consumer
electronics, Vi TECHNOLOGY’s inspection solutions o er
a uniquely integrated, accurate and scalable architecture –
an ideal complement to the Mycronic 4.0 intelligent factory.
France-based Vi TECHNOLOGY, a global pioneer
in 3D AOI and SPI, is now part of the Mycronic Group.
Already used by leading global manufacturers of
aerospace, automotive and consumer electronics,
Vi TECHNOLOGY’s inspection solutions o er a
uniquely integrated, accurate and scalable
architecture – an ideal complement to the
Mycronic 4.0 intelligent factory.
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PI series 3D SPI
Perfect solder joints
made simple
Measure paste volume with extreme precision. Improve your
process and tolerance settings with automatic pad grouping.
And monitor your process in real time, both online and o ine.
The PI series gives you highly accurate SPI data, combined
with a range of smart auto-programming functions that ensure
high-quality inspection regardless of operator experience.
ACCURATE Z-REFERENCING TECHNOLOGY
Captures hundreds of references across an
ultra-large 55 x 350 mm 3D fi eld of view.
SIMPLE AUTO-PROGRAMMING
Ensure high-quality inspection regardless of
operator experience with the industry’s only
auto-programming SPI.
REPEATABLE PROCESS RESULTS
Unique warp compensation delivers accurate
measurements in real production environments,
with no false calls.
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Clear and simple
inspection control
Eortless
auto-programming
Thanks to a natural touchscreen interface, the PI Series can easily
be set up and run by anyone with just an hour’s training. This
intuitive design allows any operator to quickly access the system’s
full capabilities with no additional calibration or fine-tuning.
The industry’s only auto-programming SPI system, the PI Series requires
only a single bare board scan to accurately program itself. No fine tuning.
No manual calibration. And no unnecessary training times needed to
bring programmers or operators up to speed.
• Let the system program itself
with just one bare board scan.
• No fine tuning required due
to smart auto-programming
functions. Performance remains
consistent regardless of color
or finish variations, making the
PI Series ideal for new product
introductions.
• Simultaneous glue dot
inspection capabilities, in
addition to paste inspection.
• Intuitive touchscreen interface
makes all system capabilities
easy to access and navigate,
with no need for keyboard or
mouse inputs.
• Automatic calibration is
carried out with the touch of
a button.
• Consistent performance over
time is ensured by embedded
geometric and radiometric
calibration tools, which also
guarantee machine-to-
machine portability.