What is New in IPC-7351C.pdf - 第17页
PC B L ibr ar i es Pr e s ents : Wh at is N ew i n IPC- 7351C Si lksc r e en Out l ine Pkg. Bo dy Ha t c hing Qua d Fla t P acka ge QFP Ba ll Gr i d Arr a y BGA P u ll -ba ck Q u ad Fla t N o - l ea d P QFN • Th e Maxim …
PCB Libraries Presents:
What is New in IPC-7351C
IPC-7351C Contour Courtyard Outlines
PCB Libraries Presents:
What is New in IPC-7351C
Silkscreen Outline Pkg. Body Hatching
Quad Flat Package
QFP
Ball Grid Array
BGA
Pull-back Quad Flat No-lead
PQFN
• The Maximum Component Body tolerance is the starting place for
mapping a silkscreen outline inside edge
• Silkscreen should only be applied to edges of the plastic component
package or hatched (corner cropping) larger component packages like
BGA, CGA and LGA packages
• It is not recommended to map silkscreen outlines to land pattern pads
PCB Libraries Presents:
What is New in IPC-7351C
Gull Wing & J-Lead, Bottom Only & Chip
Gull Wing & J-Lead Polarity
Bottom Only Polarity
Absence of Silkscreen
2-pin Component Polarity 2-pin Component Non-polarity
Silkscreen Polarity Marking