What is New in IPC-7351C.pdf - 第22页

PC B L ibr ar i es Pr e s ents : Wh at is N ew i n IPC- 7351C Com po ne nt Body & T e r m ina l Outline s • Th e N ominal C ompon e nt Bod y and T e r m i nal Le ad Outl in e s • Outp ut to CAD too l o n a me c hani …

100%1 / 51
PCB Libraries Presents:
What is New in IPC-7351C
Assembly Outline & Polarity Guidelines
Non-polarized Chip,
Crystal, Molded Body
Polarized Chip, SOD,
LED, SOT. Molded Body
Plastic Leaded Chip Carrier
PLCC, LCC, 4-sided Chip Array
Small Outline Package
SOP, SON, QFN, QFP
1.00 mm
1.00 mm
1.00 mm
0.10 mm
Line Width
PCB Libraries Presents:
What is New in IPC-7351C
Component Body & Terminal Outlines
The Nominal Component Body and Terminal Lead Outlines
Output to CAD tool on a mechanical layer
PCB Libraries Presents:
What is New in IPC-7351C
3-Tier Silkscreen Reference Designators
Silkscreen reference designators are normally placed inside the
courtyard during library construction and typically located on the
land pattern origin. After part placement has been approved, the
silkscreen ref des are relocated outside the component body so
they are visible after assembly.
The ref des line width is normally 10% of the text height
In the past, we made all silkscreen reference designators 1.50 mm
height. Fabrication technology has improved its time to support a
3-Tier reference designator option
New recommendations for the 3-Tier ref des
Least Density Level: 1.00 mm Height
Nominal Density Level: 1.20 mm Height
Most Density Level: 1.50 mm Height
REFDES