What is New in IPC-7351C.pdf - 第33页
PC B L ibr ar i es Pr e s ents : Wh at is N ew i n IPC- 7351C Ne w La nd P at t e r n Na m ing Con v ention Exte nd e d N a mes Elim ina t e Du pli ca t i on III • Com ponen t m a nu f a c turer ’ s apply diff erent to l…
PCB Libraries Presents:
What is New in IPC-7351C
Land Pattern Naming Convention
• The existing IPC-7351 land pattern naming convention does not take into
consideration component package tolerances.
• Package tolerances affect the pad, silkscreen and courtyard sizes
• You can have several packages with the same dimensions but different
tolerances but the IPC-7351 naming convention will name all the parts with
the same land pattern name
• In order to save the IPC-7351 naming convention and eliminate duplicate
land pattern names for parts with different tolerances, we need to add the
component manufacturer abbreviation as a prefix to the IPC-7351 name
• Example: SOP50P710X120-14L50T300X500 will become these names –
• TI_SOP50P710X120-14L50T300X500
• MAXIM_SOP50P710X120-14L50T300X500
• ANALOG_SOP50P710X120-14L50T300X500
Extended Names Eliminate Duplication II
PCB Libraries Presents:
What is New in IPC-7351C
New Land Pattern Naming Convention
Extended Names Eliminate Duplication III
• Component manufacturer’s apply different tolerances on
the package dimensions which creates a different footprint
pattern. So a new Naming Convention must be created for
each mfr. Case Code
• Standard Packages – MfrNameAbr_MfrCaseCode
• Unique Packages – MfrNameAbr_MfrPartNumber
• This new naming convention is exclusive to all footprints,
so instead of having one naming convention for Standard
Packages and a different naming convention for Unique
packages, a universal naming convention is needed
PCB Libraries Presents:
What is New in IPC-7351C
New Land Pattern Naming Convention
Manufacturer Names and Abbreviations
Abbreviation
Manufacturer’s Name
Abbreviation
Manufacturer’s Name
TI
Texas Instruments
LATTICE
Lattice Semiconductor
AMD
Advanced Micro Devices
SA
State of the Art
ST
ST Microelectronics
CDE
Cornell
DubilierElectron
TE
TE Connectivity
CTS
CTS
KOA
KOA Speer Electronics
MOLEX
Molex
NXP
NXP Semiconductors
ALD
Advanced Linear Devices
HTK
Honda Tsushin Kogyo
CYPRESS
Cypress Semiconductor
JAE
Japan Aviation Electron..
FOX
Fox Electronics
IQD
IQD Frequency
Products
IDT
Integrated Device Tech..
KEMET
Kemet
DIODES
Diodes, Inc.