What is New in IPC-7351C.pdf - 第44页

PC B L ibr ar i es Pr e s ents : Wh at is N ew i n IPC- 7351C Old B GA S old e r Jo int G oal R ecom me n da t io n s N o m inal B a l l Di a m e te r Re ducti o n N o m inal La nd Diam e te r La nd V a ri a t ion 0.75 2…

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PCB Libraries Presents:
What is New in IPC-7351C
New Pad Center Calculations
Nominal “E”
Nominal “L”
Toe
Pad Length = Nom “L” + Heel + Toe
Heel
Pad Centers
Pad Length
Pad Centers = Nom “E” + 2 Toes – Pad Length
C
L
PCB Libraries Presents:
What is New in IPC-7351C
Old BGA Solder Joint Goal Recommendations
Nominal Ball Diameter
Reduction
Nominal Land Diameter
Land Variation
0.75 25% 0.55
0.60
-
0.50
0.65 25% 0.50
0.55
-
0.45
0.60 25% 0.45
0.50
-
0.40
0.55 25% 0.40
0.50
-
0.40
0.50 20% 0.40
0.45
-
0.35
0.45 20% 0.35
0.40
-
0.30
0.40 20% 0.30
0.35
-
0.25
0.35 20% 0.28
0.33
-
0.23
0.30 20% 0.25
0.25
-
0.20
0.25 20% 0.20
0.20
-
0.17
0.20 15% 0.17
0.20
-
0.14
PCB Libraries Presents:
What is New in IPC-7351C
New Collapsing BGA SJG Recommendations
Proportional SMD Pad Stack
Collapsing Ball Grid Array (BGA)
Pin Pitch
Adj. %
New Pad Size
Old Pad Size
Pad Round
-
off
Courtyard Excess
Nominal Ball (mm) Fixed Fixed
80% of Pin Pitch
0.75 1.27 80% 0.60 0.60 0.01 1.00
0.60 1.00 80% 0.48 0.50 0.01 0.80
0.55 1.00 80% 0.44 0.45 0.01 0.80
0.50 0.80 80% 0.40 0.45 0.01 0.65
0.45 0.80 80% 0.36 0.40 0.01 0.65
0.35 0.65 80% 0.28 0.33 0.01 0.50
0.30 0.65 80% 0.24 0.25 0.01 0.50
0.25 0.50 80% 0.20 0.20 0.01 0.40
0.20 0.45 80% 0.16 0.20 0.01 0.35
A Single Simple Ball Diameter to Pad Size Calculation