What is New in IPC-7351C.pdf - 第47页

PC B L ibr ar i es Pr e s ents : Wh at is N ew i n IPC- 7351C • Co m p o ne nt F am i l y Gr o up in g by Pi n Quant it y • 3D M o d el Pi c t ure o f E ac h C o mp o n en t • L an d P at te rn Pi c t ure s w it h L e ve…

100%1 / 51
PCB Libraries Presents:
What is New in IPC-7351C
New Non-collapsing BGA SJG Recommendation
Proportional SMD Pad Stack
Non
-
Collapsing Ball Grid Array
Pin Pitch
Adj. %
Pad Size
Pad Round
-
off
Courtyard Excess
Nominal Ball (mm) Fixed Fixed
80% of Pin Pitch
0.75 1.27
100%
0.75 0.00 1.00
0.60 1.00
100%
0.60 0.00 0.80
0.55 1.00
100%
0.55 0.00 0.80
0.50 0.80
100%
0.50 0.00 0.65
0.45 0.80
100%
0.45 0.00 0.65
0.35 0.65
100%
0.35 0.00 0.50
0.30 0.65
100%
0.30 0.00 0.50
0.25 0.50
100%
0.25 0.00 0.40
0.20 0.45
100%
0.20 0.00 0.35
0.17 0.40
100%
0.17 0.00 0.30
0.15 0.35
100%
0.15 0.00 0.30
PCB Libraries Presents:
What is New in IPC-7351C
• Component Family Grouping by Pin Quantity
• 3D Model Picture of Each Component
• Land Pattern Pictures with Level A & B Rotations
• Updated Solder Joint Goal Tables
• Naming Convention: Mfr. Part Number or Case
• New Chapter on Aspects of 3D Modeling
• Appendix Introduces Drafting Outline Guidelines
• Relocating all Assembly Related Data to the new
IPC-7070 Component Mounting Issues and
Recommendations
Chapters 8 & 9 – Total Rewrite
PCB Libraries Presents:
What is New in IPC-7351C
PCB Library Expert