80S-20用户手册 - 第36页
1 Introduction SIPLACE 80S-20 /F4 User Manual 1.5 Description of the m achine Software v ersion SR.407.xx 01/2001 US Edition 36 1.5.3 Functional description of the SIPLACE 80F 4 1 Fig. 1.5 - 2 General view of t he F 4 pl…
SIPLACE 80S-20/F4 User Manual 1 Introduction
Software version SR.407.xx 01/2001 US Edition 1.5 Description of the machine
35
1.5.2 Technical data – overview of the SIPLACE 80S-20
Procedure collect&place
Component range
vision module from 0402 to 18,7 mm x 18,7mm
Max. placement rate
12-segment Collect&Place head 20,000 components/hour
12-segment Collect&Place head
Angular accuracy
Placement accuracy
± 0.525°/ 3 σ, ± 0.70°/ 4 σ, ± 1.05°/ 6 σ
± 67.5µm / 3 σ, 90µm / 4 σ, 135µm / 6 σ
PCB format 50mm x 50mm to 460mm x 460mm
(optionally 460mm x 508mm,18" x 20")
Feeder capacity 40 locations for feeders
Component supply
Types of feeder
Changeover table,
component tapes, stick magazines, bulk cases
Operating system Microsoft Windows NT / RMOS
Connection In-line or stand alone
Space required 4 m² / module
1 Introduction SIPLACE 80S-20/F4 User Manual
1.5 Description of the machine Software version SR.407.xx 01/2001 US Edition
36
1.5.3 Functional description of the SIPLACE 80F
4
1
Fig. 1.5 - 2 General view of the F
4
placement machine
(1) 12-segment Collect&Place head with component vision module
(2) Gantry with PCB vision module
(3) Pick&Place head
(4) Fine pitch vision module for the Pick&Place head
(5) Stationary component supply (location 1)
(6) Stationary component supply (location 3)
(7) PCB conveyor ( dual conveyor option)
SIPLACE 80S-20/F4 User Manual 1 Introduction
Software version SR.407.xx 01/2001 US Edition 1.5 Description of the machine
37
The F
4
placement machine is a high-speed placement machine with a gantry axis system. The
gantry supports: 1
– a PCB vision module,
– a star-shaped 12-segment Collect&Place head, and
– a Pick&Place head.
The 12-segment Collect&Place head will increase the placement rate if the proportion of ICs in
the placement process is very high. 1
The Pick&Place head is particularly suitable for inserting fine pitch components. In addition to the
vision module for PCB centering, the F
4
machine also has component vision modules for the Col-
lect&Place head and Pick&Place head. 1
A coplanarity laser module and a flip chip vision module can also be retrofitted as options. 1
A wafflepack changer can be used to supply components. 1
The placement heads pick up components from stationary feeders and then place them in the
PCBs clamped on the PCB conveyor. 1
1
The concept behind the placement machine 1
– with its stationary feeders,
– with PCBs that do not move during placement,
– and its positionable placement heads
has number of significant benefits: 1
– For example, the flexible 12-segment Collect&Place head combined with automatic nozzle
changer enables the nozzle configuration to be changed temporarily and automatically
adapted to receive different component sizes You can also optimize the travel paths, and the
placement sequence.
– With stationary feeders, even the tiniest components are picked up reliably.
– The components cannot slip on the PCB during placement (as is often the case with moving
PCBs) since the PCB does not move.
– Sophisticated optical centering systems (vision systems) for components and PCBs also en-
sure high component positioning accuracy.
– Components can be topped up and tapes can be spliced without stopping the machine.
– Prepared component tables enable the placement machine to be retooled without long idle
times.
1