80S-20用户手册 - 第496页

11 Station extensions /Hardware SIPLACE 80S-20 /F4 User Manual 11.7 Flip-chip vision m odule for the Pick & P lace head Software version SR.407.xx 01/2001 US Edition 496 1 1.7.3 T e chnica l dat a 11 Flip -chip size …

SIPLACE 80S-20/F4 User Manual 11 Station extensions /Hardware

Software version SR.407.xx 01/2001 US Edition 11.7 Flip-chip vision module for the Pick & Place head

495

11.7.1 Functional description

The flip-chip vision module increases the capability for processing fine-pitch and flip-chip compo-

nents with extremely fine lead pitches. This add-on module for the fine-pitch vision module in-

creases the resolution many times. The lighting layout is fundamentally different. At optimal

illumination, the images of bumps are as large as possible, and disruptive orthogonal structures

(as can occur on chip printed conductor tracks, for example) are suppressed. With less pro-

nounced disruptive structures, enhanced illumination intensity can be achieved by combining

lighting fixtures, resulting in high recognition reliability, even with the generally square connection

surfaces of ‘bumped’ flip-chips as used in conductive adhesive technology. Special search algo-

rithms are used to recognize the bumps in environments subject to disruption. 11

11.7.2 Safety instructions for the component vision modules on Fx machines

DANGER

NEVER modify or bypass safety devices on the Fx machine, or on the fine-pitch or flip-chip mod-

ule. 11

The optical radiation from the fine-pitch or flip-chip vision module conforms to laser class 1, pro-

vided that the module is permanently installed in the placement machine, and the protective hoods

are closed (EN 60825-1 and IEC 825). 11

Fig. 11.7 - 2 Identification of laser class 1

Laser Class 1

11 Station extensions /Hardware SIPLACE 80S-20/F4 User Manual

11.7 Flip-chip vision module for the Pick & Place head Software version SR.407.xx 01/2001 US Edition

496

11.7.3 Technical data

Flip-chip size

with single measurement

with multiple measurement

1x1mm

up to 7x9mm

up to 20mmx20mm

Dimension < 3mmx6mm Special nozzle, feeding tolerance < 0.2 mm edge length

Minimum bump diameter 80µm

Placement cycle minimum 2sec (depending on the number of bumps)

IC grid:

Lead pitch

Bump pitch

0.25mm

0.15mm

Field of view 9mmx11.5mm

Method of illumination Front lighting (3 levels programmable as required)

SIPLACE 80S-20/F4 User Manual 11 Station extensions /Hardware

Software version SR.407.xx 01/2001 US Edition 11.8 Coplanarity laser module (80F4)

497

11.8 Coplanarity laser module (80F

)

11.8.1 Functional description

The coplanarity laser module is used to measure vertical bending of the leads. The lead length is

measured without contact using the laser triangulation principle. 11

The placement head picks up the component to be checked, centers it optically using the IC cam-

era, and moves all four sides one after another over the fixed laser beam of the coplanarity laser

module. In this way, every lead is scanned from below by the laser beam. The laser light scattered

by the underside of the lead is recorded by a sensor, and is then used to calculate the exact po-

sition of the lead with respect to the PCB. The position values thus calculated are compared

against the limit value specified by the user. If they exceed this value, the component is disposed

of or reworked. 11

Fig. 11.8 - 1 Principle of laser triangulation

(1) Receiver lens (2) Detector

(3) Measuring signal (4) Time t

(5) Laser (6) Transmitter lens

(7) Travel direction 11